Experimental study of the voids in the electroless copper deposits and the direct measurement of the void fraction based on the scanning electron microscopy images

Applied Surface Science

Volumn 255, Issue 7, 2009, Pages 4259-4266

  Wu, Xiaomin ^a   Sha, Wei ^a  

^a QUEEN'S UNIVERSITY BELFAST   (United Kingdom)

Author keywords

Copper; Electroless plating; Over etching; Scanning electron microscopy; Void

Indexed keywords

COPPER; COPPER DEPOSITS; DEPOSITS; ELECTROLESS PLATING; EPOXY RESINS; IMAGE PROCESSING; MATLAB; SUBSTRATES; TEMPERATURE; VOID FRACTION;

DIRECT MEASUREMENT; ELECTROLESS COPPER; HIGH OPERATING TEMPERATURE; LOW TEMPERATURE SOLUTIONS; OVER-ETCHING; SCANNING ELECTRON MICROSCOPY IMAGE; STAINLESS STEEL SUBSTRATES; VOID;

SCANNING ELECTRON MICROSCOPY;

EID: 58149085271     PISSN: 01694332     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.apsusc.2008.11.015     Document Type: Article

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