Evaluation of the influence of Bi and Sb additions to Sn-Ag-Cu and Sn-Zn alloys on their surface tension and wetting properties using analysis of variance - ANOVA

Soldering and Surface Mount Technology

Volumn 20, Issue 4, 2008, Pages 9-19

  Bukat, K ^a   Sitek, J ^a   Kisiel, R ^b   Moser, Z ^c   Gaesior W ^c   Koscielski M ^a   Pstrus J ^c  

^a TELE AND RADIO RESEARCH INSTITUTE   (Poland)

^b WARSAW UNIVERSITY OF TECHNOLOGY   (Poland)

^c INSTITUTE OF METALLURGY AND MATERIALS SCIENCE   (Poland)

Author keywords

Alloys; Solders; Surface chemistry

Indexed keywords

COPPER; COPPER ALLOYS; METALLIC COMPOUNDS; REGRESSION ANALYSIS; SILVER; SURFACE CHEMISTRY; SURFACE TENSION; TIN; WETTING; ZINC; ZINC ALLOYS;

ALLOYS; SN-AG-CU; SOLDERS; WETTING PROPERTIES;

TIN ALLOYS;

EID: 51349155160     PISSN: 09540911     EISSN: None     Source Type: Journal    
DOI: 10.1108/09540910810902660     Document Type: Article

References (20)

1. Bukat, K., Moser, Z., Gsior, W., Sitek, J., Kościelski, M. and Pstruś, J. (2008), "Trends in wettability studies of Pb-free solders. Basic and application. Part II. Relation between surface tension, interfacial tension and wettability of lead-free Sn-Zn and Sn-Zn-Bi-Sb alloys", Archives of Metallurgy and Materials (in print)..
2. Friedel, K., Kisiel, R. and Łoziński, W. (1997), "A study of wetting performance of lead-free solders", Proceedings of the 20th International Spring Seminar on Electronic Technology, ISSE'97, June 8-11, Szklarska Porba, Poland, pp. 13-18.
3. eut + Cu soldering materials, Part I: wettability studies", Journal of Phase Equilibria and Diffusion, Vol. 115, p. 121.
4. Hwang, J.S. (2001), Environmental-Friendly Electronics: Lead-Free Technology, Electrochemical Publications Ltd, Bristol, UK.
5. Hwang, J.S. (2005), Implementing Lead-Free Electronics, McGraw-Hill Ltd, New York, NY.
6. Katayama, N., Tanaka, H., Akanuma, M., Myiazaki, M., Ogata, S., Yoshida, A. and Nishiyama, Y. (2004), "Wave soldering process with Sn-Zn lead-free solders", Proceedings of Electronics Goes Green 2004+, Fraunhofer IZM, Berlin, Germany.
7. Lopez, E.P., Vianco, P.T. and Rejent, J.A. (2005), "Solderability testing of Sn-Ag-XCu Pb-free solders on copper and Au-Ni plated kovar substrates", Journal of Electronic Materials, Vol. 34 No. 3, pp. 299-310.
8. Mayappan, R., Ismail, A., Ahmad, Z., Ariga, T. and Hussain, L. (2006), "Effect of sample perimeter and temperature on Sn-Zn based lead-free solders", Materials Letters, Vol. 60, pp. 2383-9.
9. Miyazaki, M., Mizutani, M., Takemoto, T. and Matsunawa, A. (1997a), "Measurement of surface tension with wetting balance", Quarterly Journal of the Japan Welding Society, Vol. 681 -687.
10. Miyazaki, M., Mizutani, M., Takemoto, T. and Matsunawa, A. (1997b), "Condition for measurement of surface tension of solders with a wetting balance tester", Transactions of JWRI, Vol. 26 No. 1, pp. 81-4.
11. Moser, Z., Gsior, W., Dbski, A. and Pstruś, J. (2007), Database of Lead-Free Soldering Materials, Institute of Metallurgy and Materials Science, Polish Academy of Sciences, Orekop, Krakow, Poland.
12. Moser, Z., Gsior, W., Bukat, K., Pstruś, J. and Sitek, J. (2008), "Trends in wettability studies of Pb-free solders. Basic and application. Part I. Surface tension and density measurements of Sn-Zn and Sn-Zn-Bi-Sb alloys. Experiment vs. modeling", Archives of Metallurgy and Materials (in print)..
13. Moser, Z., Gsior, W., Pstruś, J., Ohnuma, I. and Ishida, K. (2006), "Influence of Sb additions on surface tension and density of Sn-Sb, Sn-Ag-Sb and Sn-Ag-Cu-Sb alloys: experiment vs. modeling", International Journal of Materials Research (formerly Z. Metallkd.), Vol. 97 No. 4, pp. 365-70.
14. Moser, Z., Gsior, W., Bukat, K., Pstruś, J., Kisiel, R., Sitek, J., Ishida, K. and Ohnuma, I. (2006), "Pb-free solders. Part I. Wettability testing of Sn-Ag-Cu alloys with Bi additions", Journal of Phase Equilibria and Diffusion, Vol. 27 No. 2, pp. 133-9.
15. Moser, Z., Gsior, W., Bukat, K., Pstruś, J., Kisiel, R., Sitek, J., Ishida, K. and Ohnuma, I. (2007), "Pb-free solders. Part III. Wettability testing of Sn-Ag-Cu-Bi alloys with Sb additions", Journal of Phase Equilibria and Diffusion, Vol. 28 No. 5, pp. 433-8.
16. Moser, Z., Gsior, W., Pstruś, J., Ishihara, S., Liu, X.J., Ohnuma, I., Kainuma, R. and Ishida, K. (2004), "Surface tension and density measurements of Sn-Ag-Sb liquid alloys and phase diagram calculations of the Sn-Ag-Sb ternary system", Materials Transactions, Vol. 45 No. 3, pp. 652-60.
17. Ohnuma, I., Ishida, K., Moser, Z., Gsior, W., Bukat, K., Pstruś, J., Kisiel, R. and Sitek, J. (2006), "Pb-free solders. Part II. Application of ADAMIS database in modeling of Sn-Ag-Cu alloys with Bi additions", Journal of Phase Equilibria and Diffusion, Vol. 27 No. 3, pp. 245-54.
18. Peace, G.S. (1993), Taguchi Methods, A Hands-on Approach, Addison-Weslley Publishing Company, Reading, MA.
19. Yu, D.Q., Xie, H.P. and Wang, L. (2004), "Investigation of interfacial microstructure and wetting property of newly developed Sn-Zn-Cu solders with Cu substrate", Journal of Alloys and Compounds, Vol. 385, pp. 119-25.
20. Zhou, J., Sun, Y. and Xue, F. (2005), "Properties of low melting point Sn-Zn-Bi solders", Journal of Alloys and Compounds, Vol. 397, pp. 260-4.