Improving low-Ag Pb-free solder performance by adding Bi, Ni elements

Advanced Materials Research

Volumn 189-193, Issue , 2011, Pages 3498-3502

  Sun, Feng Lian ^a   Liu, Yang ^a   Wang, Jia Bing ^a   Zhang, Hong Wu ^a  

^a HARBIN UNIVERSITY OF SCIENCE AND TECHNOLOGY   (China)

Author keywords

Electromigration; HTS aging; IMC; Solderability

Indexed keywords

ADDITIVE ELEMENTS; BULK-LIKE; HIGH TEMPERATURE STORAGE; HTS AGING; IMC; INTERMETALLIC COMPOUNDS; NEEDLE-LIKE; PB FREE SOLDERS; POSITIVE EFFECTS; SN-AG-CU; SOLDER ALLOYS; SOLDERABILITY;

ELECTROMIGRATION; INTERMETALLICS; LEAD; MANUFACTURE; SILVER; SILVER ALLOYS; SOLDERING; TIN;

SOLDERING ALLOYS;

EID: 79952542089     PISSN: 10226680     EISSN: None     Source Type: Book Series    
DOI: 10.4028/www.scientific.net/AMR.189-193.3498     Document Type: Conference Paper

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