Improvement of oxidation resistance of copper by atomic layer deposition

Applied Surface Science

Volumn 258, Issue 24, 2012, Pages 10128-10134

  Chang, M L ^a   Cheng, T C ^a   Lin, M C ^b   Lin, H C ^a   Chen, M J ^a  

^a NATIONAL TAIWAN UNIVERSITY   (Taiwan)

^b TAIPEI MEDICAL UNIVERSITY   (Taiwan)

Author keywords

Adhesion strength; Atomic layer deposition; Copper; Oxidation resistance

Indexed keywords

ADHESION; ALUMINA; ALUMINUM OXIDE; ATOMS; BOND STRENGTH (MATERIALS); CHEMICAL ANALYSIS; COPPER; DURABILITY; ELECTRONICS PACKAGING; OXIDATION RESISTANCE; PROTECTIVE COATINGS;

ACCELERATED TEMPERATURE CYCLING; CHEMICAL COMPOSITIONS; COFFIN-MANSON MODELS; FILM CHARACTERISTICS; MECHANIC PROPERTIES; OXIDATIVE ATTACK; PURE COPPER; SUBSTRATE TEMPERATURE;

ATOMIC LAYER DEPOSITION;

EID: 84864708585     PISSN: 01694332     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.apsusc.2012.06.090     Document Type: Article

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