Molecular dynamics study of adhesion strength and diffusion at interfaces between interconnect materials and underlay materials

Computational Mechanics

Volumn 25, Issue 1, 2000, Pages 78-86

  Iwasaki, T ^a  

^a HITACHI LTD   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; COPPER; DIFFUSION IN SOLIDS; INTERCONNECTION NETWORKS; INTERFACES (MATERIALS); METALLIC FILMS; SCANNING ELECTRON MICROSCOPY; ULSI CIRCUITS;

ADHESION STRENGTH; UNDERLAY MATERIALS;

MOLECULAR DYNAMICS;

EID: 0033878975     PISSN: 01787675     EISSN: None     Source Type: Journal    
DOI: 10.1007/s004660050017     Document Type: Article

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