Oxidation prevention and electrical property enhancement of copper-filled isotropically conductive adhesives

Journal of Electronic Materials

Volumn 36, Issue 10, 2007, Pages 1341-1347

  Yim, Myung Jin ^a   Li, Yi ^a   Moon, Kyoung Sik ^a   Wong, C P ^a  

^a Georgia Institute of Technology   (United States)

Author keywords

Antioxidant; Copper; Electrical contact resistance; Isotropic conductive adhesive (ICA); Reliability; Silane coupling agent

Indexed keywords

ANTIOXIDANTS; ELECTRICAL CONTACT RESISTANCE; ISOTROPIC CONDUCTIVE ADHESIVE; SILANE COUPLING AGENT;

ATMOSPHERIC HUMIDITY; COPPER; MOLECULAR WEIGHT; OXIDATION; RELIABILITY THEORY; THERMAL EFFECTS; THERMODYNAMIC STABILITY;

ADHESIVES;

EID: 34848858668     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-007-0204-7     Document Type: Article

References (11)

1. Y. Li, K. Moon, and C.P. Wong, Science, 308, 1419 (2005).
2. Y. Li and C.P. Wong, Mater. Sci. Eng. R, 51, 1 (2006).
3. R.L. Dietz, et al., Solder. Surf. Mount Technol., 9, 55 (1997).
4. D. Cavasin, K. Brice-Heams, and A. Arab, Proceedings of the 53rd Electronic Components and Technology Conference (2003), p. 1404
5. R. Kisiel, J. Electron. Packaging, 124, 367 (2002).
6. H. de Vries, J. van Delft, and K. Slob, IEEE Trans. Compon. Packaging Technol., 28, 499 (2005).
7. S.G. Hong and M.D. Ho, J. Environ. Sci. Health, Part A, 34, 2043 (1999).
8. S.K. Kang, S. Buchwalter, and C. Tsang, J. Electron. Mater., 29, 1278 (2000).
9. Y.S. Tan, M.P. Srinivasan, and S.O. Pehkonen, J. Vac. Sci. Technol., A, 22, 1917 (2004).
10. M.M. Sung, K. Sung, C.G. Kim, S.S. Lee, and Y. Kim, J. Phys. Chem. B, 104, 2273 (2000).
11. T. Hatanaka and K. Nozaki, Japanese patent 62099483 (1987).