Development of conductive adhesive materials for via fill applications

IEEE Transactions on Components and Packaging Technologies

Volumn 24, Issue 3, 2001, Pages 431-435

  Kang, Sung K ^a   Buchwalter, Stephen L ^a   LaBianca, Nancy C ^a   Gelorme, J ^a   Purushothaman, Sampath ^a   Papathomas, K ^b   Poliks, M ^b  

^a IBM T J WATSON RESEARCH CENTER   (United States)

^b IBM MICROELECTRONICS   (United States)

Author keywords

BiSn coated Cu powder; Conductive adhesives; Pb free conducting materials; Printed circuit boards; Sn coated Cu powder; Via fill

Indexed keywords

ADDITIVES; ELECTRIC PROPERTIES; MICROELECTRONIC PROCESSING; MOBILE TELECOMMUNICATION SYSTEMS; PRINTED CIRCUIT BOARDS; SUBSTRATES; THERMOSETS;

ANY LAYER INNER VIA HOLE; BUIL-UP MULTILAYER; ELECTRIC CONTINUITY; PLATED THROUGH HOLE; SURFACE LAMINAR CIRCUIT;

CONDUCTIVE MATERIALS;

EID: 0035441359     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/6144.946490     Document Type: Article

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25. Method for applying curable fill composition to apertures in a substrate