Surface modification of Ag coated Cu conductive metal powder for conductive silicone sealant gasket paste

Materials Science Forum

Volumn 534-536, Issue PART 2, 2007, Pages 933-936

  Park, Seong Yong ^a   Yoon, Tae Won ^b   Lee, Chung Ho ^b   Jeong, In Bum ^b   Hyun, Sang Hoon ^a  

^a Yonsei University   (South Korea)

^b Chang Sung Corporation   (South Korea)

Author keywords

Ag coated Cu; Dispersing agent; EMI shielding gasket; Silane coupling agent

Indexed keywords

BINDERS; CHEMICAL MODIFICATION; COATED MATERIALS; CONDUCTIVE MATERIALS; CORROSION; ELECTRIC CONDUCTIVITY; SURFACE STRUCTURE;

CONDUCTIVE FILLERS; CONDUCTIVE PASTES; CORROSION STABILITY; DISPERSING AGENTS; SILANE COUPLING AGENTS; SURFACE CORROSION;

COPPER POWDER METALLURGY;

EID: 38349170632     PISSN: 02555476     EISSN: 16629752     Source Type: Book Series    
DOI: 10.4028/0-87849-419-7.933     Document Type: Conference Paper

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