The dependence on thermal history of the electrical properties of an epoxy-based isotropic conductive adhesive

Journal of Electronic Materials

Volumn 36, Issue 6, 2007, Pages 669-675

  Inoue, Masahiro ^a   Suganuma, Katsuaki ^a  

^a OSAKA UNIVERSITY   (Japan)

Author keywords

Annealing; Curing; Electrical resistivity; Electrically conductive adhesives; Percolation

Indexed keywords

CURING TEMPERATURE; ELECTRICALLY CONDUCTIVE ADHESIVES; EPOXY BASED BINDERS; POSTANNEALING EFFECTS;

ANNEALING; CONDUCTIVE MATERIALS; CURING; ELECTRIC CONDUCTIVITY; EPOXY RESINS; GLASS TRANSITION;

ADHESIVES;

EID: 34249892436     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-007-0125-5     Document Type: Article

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