Compact thermal resistor-capacitor-network approach to predicting transient junction temperatures of a power amplifier module

IEEE Transactions on Components, Packaging and Manufacturing Technology

Volumn 2, Issue 7, 2012, Pages 1172-1181

  Yu, Youmin ^a   Lee, Tien Yu Tom ^b   Chiriac, Victor Adrian ^c  

^a University of Minnesota   (United States)

^b Silicon Backend and Packaging/Assembly Oracle   (United States)

^c QUALCOMM INC   (United States)

Author keywords

Foster network; junction temperature; Kirchhoff's current law; Laplace transformation; method of superposition; semiconductor package; thermal resistor capacitor (RC) network

Indexed keywords

JUNCTION TEMPERATURES; KIRCHHOFF'S CURRENT LAW; LAPLACE TRANSFORMATIONS; METHOD OF SUPERPOSITION; RESISTOR CAPACITORS; SEMICONDUCTOR PACKAGES;

CAPACITORS; DIFFERENTIAL EQUATIONS; FORECASTING; INFORMATION SERVICES; POWER AMPLIFIERS; THERMISTORS;

LAPLACE TRANSFORMS;

EID: 84863774770     PISSN: 21563950     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCPMT.2012.2198885     Document Type: Article

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