Transient thermal modeling and characterization of a hybrid component

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 1996, Pages 154-164

  Christiaens, Filip ^a   Beyne, Eric ^a  

^a IMEC   (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

CAPACITANCE; ELECTRONICS PACKAGING; FINITE ELEMENT METHOD; HEAT RESISTANCE; MATHEMATICAL MODELS; STEP RESPONSE; THERMAL VARIABLES MEASUREMENT; TRANSIENTS;

HYBRID THERMAL TEST CHIP; THERMAL IMPEDANCE; TRANSIENT THERMAL MODELING;

HYBRID INTEGRATED CIRCUITS;

EID: 0029717958     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (7)