High-precision compact-thermal models

IEEE Transactions on Components and Packaging Technologies

Volumn 28, Issue 4, 2005, Pages 623-629

  Sabry, Mohamed Nabil ^a  

^a Universite Francaise d'Egypte   (Egypt)

Author keywords

Compact thermal models; Precision

Indexed keywords

BOUNDARY CONDITIONS; GREEN'S FUNCTION; HEAT CONDUCTION; HEAT CONVECTION; HEAT FLUX; MATHEMATICAL MODELS; MULTICHIP MODULES;

COMPACT-THERMAL MODELS; HEAT SOURCES; HIGH-PRECISION MODELS;

CHIP SCALE PACKAGES;

EID: 29244435362     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2005.859666     Document Type: Article

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