Synthesis of thermal RC-networks for systems-in-packages

IEEE Transactions on Components and Packaging Technologies

Volumn 27, Issue 1, 2004, Pages 117-123

  Kyyhkynen, Vesa ^a   Valtanen, Jani ^b   Ristolainen, Eero ^b  

^a NOKIA RESEARCH CENTER   (United States)

^b TAMPERE UNIVERSITY OF TECHNOLOGY   (Finland)

Author keywords

Compact model; Multichip module (MCM); System in package (SiP); Thermal characterization; Thermal modeling

Indexed keywords

COMPUTER SIMULATION; FINITE ELEMENT METHOD; INTEGRATED CIRCUIT LAYOUT; MATHEMATICAL MODELS; MULTICHIP MODULES; OPTIMIZATION; TEMPERATURE;

COMPACT MODEL; SYSTEM-IN-PACKAGE; THERMAL CHARACTERIZATION; THERMAL MODELLING;

ELECTRONICS PACKAGING;

EID: 2442505466     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2004.825773     Document Type: Article

References (13)

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