How to extend a thermal-RC-network model (derived from experimental data) to respond to an arbitrarily fast input

Annual IEEE Semiconductor Thermal Measurement and Management Symposium

Volumn , Issue , 1998, Pages 8-15

  Stout, Roger Paul ^a   Billings, David T ^a  

^a MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC NETWORK ANALYSIS; ELECTRONICS PACKAGING; FINITE ELEMENT METHOD; LUMPED PARAMETER NETWORKS; THERMAL EFFECTS; TIME DOMAIN ANALYSIS;

THERMAL TRANSIENT RESPONSE;

SEMICONDUCTOR DEVICE MODELS;

EID: 0031701170     PISSN: 10652221     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)