Retardation of electromigration-induced Ni(P) consumption by an electroless Pd insertion layer

Applied Physics Letters

Volumn 96, Issue 23, 2010, Pages

  Lu, C T ^a   Tseng, H W ^a   Chang, C H ^a   Huang, T S ^a   Liu, C Y ^a  

^a NATIONAL CENTRAL UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

BOND PAD; COMPOUND LAYER; ELECTROLESS; EM RESISTANCE; ENHANCED DIFFUSION; HIGH CURRENT DENSITIES; INSERTION LAYERS; SOLDER BUMP;

ELECTROMIGRATION; PALLADIUM;

TIN;

EID: 77953498006     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.3449119     Document Type: Article

References (13)

1. P. Snugovsky, P. Arrowsmith, and M. Romansky, J. Electron. Mater. JECMA5 0361-5235 30, 1262 (2001). 10.1007/s11664-001-0159-z
2. M. O. Alam, Y. C. Chan, and K. C. Hung, Microelectron. Reliab. MCRLAS 0026-2714 42, 1065 (2002). 10.1016/S0026-2714(02)00068-9 (Pubitemid 34648971)
3. G. Milad and M. Orduz, Met. Finish. MEFIA7 0026-0576 105, 25 (2007). 10.1016/S0026-0576(07)80007-9 (Pubitemid 46994683)
4. K. J. Puttlitz and K. A. Stalter, Handbook of Lead-Free Solder Technology for Microelectronic Assemblies (Dekker Mechanical Engineering, New York, 2004).
5. C. T. Lin, Y. C. Chuang, S. J. Wang, and C. Y. Liu, Appl. Phys. Lett. APPLAB 0003-6951 89, 101906 (2006). 10.1063/1.2344857 (Pubitemid 44359605)
6. C. Y. Liu, C. Chen, and K. N. Tu, J. Appl. Phys. JAPIAU 0021-8979 88, 5703 (2000). 10.1063/1.1319327
7. H. Gan and K. N. Tu, J. Appl. Phys. JAPIAU 0021-8979 97, 063514 (2005). 10.1063/1.1861151 (Pubitemid 40818141)
8. K. C. Hung and Y. C. Chan, J. Mater. Sci. Lett. JMSLD5 0261-8028 19, 1755 (2000). 10.1023/A:1006735103744
9. J. W. Jang, P. G. Kim, and K. N. Tu, J. Appl. Phys. JAPIAU 0021-8979 85, 8456 (1999). 10.1063/1.370627
10. Y. C. Sohn, Jin Yu, S. K. Kang, D. Y. Shih, and T. Y. Lee, J. Mater. Res. JMREEE 0884-2914 19, 2428 (2004). 10.1557/JMR.2004.0297
11. M. Mita, M. Kajihara, N. Kurokawa, and K. Sakamoto, Mater. Sci. Eng., A MSAPE3 0921-5093 403, 269 (2005). 10.1016/j.msea.2005.05.012 (Pubitemid 41110251)
12. T. B. Massalski, H. Okamoto, P. R. Subramanian, and L. Kacprzak, Binary Alloy Phase Diagrams, 2nd ed. (ASM International, Materials Park, OH, 1990), Vol. 3, p. 2863.
13. R. R. Chromik, and E. J. Cotts, Thermodynamics and Kinetics of Phase Transformations (Materials Research Society, Pittsburgh, 1996), p. 307.