Strong effect of Pd concentration on the soldering reaction between Ni and Sn-Pd alloys

Journal of Materials Research

Volumn 25, Issue 11, 2010, Pages 2078-2081

  Ho, Cheng En ^a   Gierlotka, Wojciech ^a   Lin, Sheng Wei ^a  

^a YUAN ZE UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

CALPHAD METHOD; MICROSTRUCTURE EVOLUTIONS; PD ALLOY; PREDOMINANT REACTIONS; SOLDER JOINTS; SOLDERING REACTIONS;

CERIUM ALLOYS; PALLADIUM; REACTION PRODUCTS; SOLDERING; SOLDERING ALLOYS; TIN;

TIN ALLOYS;

EID: 78049498653     PISSN: 08842914     EISSN: None     Source Type: Journal    
DOI: 10.1557/jmr.2010.0268     Document Type: Article

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