Kinetics of solid-state reactive diffusion between Sn-Ni alloys and Pd

Journal of Alloys and Compounds

Volumn 484, Issue 1-2, 2009, Pages 273-279

  Tanaka, S ^a   Kajihara, M ^a  

^a TOKYO INSTITUTE OF TECHNOLOGY   (Japan)

Author keywords

Intermetallics; Metals; Surfaces and interfaces

Indexed keywords

ANNEALING TIME; COMPOUND LAYER; DIFFUSION BONDING TECHNIQUE; DIFFUSION COUPLE; ENERGIZATION; GROWTH BEHAVIOR; HEATING TEMPERATURES; ISOTHERMALLY ANNEALED; MOL FRACTION; SN-NI ALLOY; SOLID-STATE REACTIVE DIFFUSION; SURFACES AND INTERFACES; VOLUME DIFFUSION;

ANNEALING; BINARY ALLOYS; DIFFUSION; GRAIN GROWTH; GROWTH KINETICS; HEATING; INTERMETALLICS; MULTILAYERS; NICKEL; PALLADIUM; TIN ALLOYS;

TIN;

EID: 69949095748     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2009.04.077     Document Type: Article

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