Massive spalling of intermetallics in solder joints: A general phenomenon that can occur in multiple solder-substrate systems

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2007, Pages 1825-1830

  Yang, S C ^a   Kao, C R ^b  

^a NATIONAL CENTRAL UNIVERSITY   (Taiwan)

^b NATIONAL TAIWAN UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

INTERMETALLICS; LEAD; SPALLING; THERMODYNAMICS; WETTING;

NON EQUILIBRIUM PHASE; SUBSTRATE METALLURGY; UNDER BUMP METALLURGY (UBM); WETTABLE LAYERS;

SOLDERED JOINTS;

EID: 35348866707     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2007.374045     Document Type: Conference Paper

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