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Thin Solid Films

Volumn 520, Issue 17, 2012, Pages 5542-5549

Strain evolution during spinodal decomposition of TiAlN thin films

(6) Rogstrom L a Ullbrand, J a Almer, J b Hultman, L a Jansson, B a,c Oden M a

a LINKÖPING UNIVERSITY (Sweden)

b ARGONNE NATIONAL LABORATORY (United States)

c SECO TOOLS AB (Sweden)

Author keywords

High energy X ray diffraction; Phase field simulations; Spinodal decomposition; Thin films; Titanium aluminum nitride

Indexed keywords

AL CONTENT; ALLOY COMPOSITIONS; ALN; COMBINED EFFECT; COMPRESSIVE STRAIN; CUBIC ALN; DECOMPOSITION RATE; DRIVING FORCES; HIGH ENERGY X-RAY DIFFRACTION; IN-SITU; MAXIMUM HARDNESS; MICROSTRUCTURE EVOLUTIONS; PHASE EVOLUTIONS; PHASE-FIELD SIMULATION; STRAIN EVOLUTION; STRAIN FORMATION; THERMAL STRAIN; TIALN FILM; TITANIUM ALUMINUM NITRIDE;

ALUMINUM; ALUMINUM NITRIDE; MICROSTRUCTURE; SPINODAL DECOMPOSITION; STRAIN; TITANIUM; TITANIUM NITRIDE; X RAY DIFFRACTION;

THIN FILMS;

EID: 84861809347 PISSN: 00406090 EISSN: None Source Type: Journal
DOI: 10.1016/j.tsf.2012.04.059 Document Type: Article

Times cited : (110)

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