Layer formation by resputtering in Ti-Si-C hard coatings during large scale cathodic arc deposition

Surface and Coatings Technology

Volumn 205, Issue 15, 2011, Pages 3923-3930

  Eriksson, A O ^a   Zhu, J Q ^a   Ghafoor, N ^a   Johansson, M P ^a,b   Sjolen J ^a   Jensen, J ^a   Oden M ^a   Hultman, L ^a   Rosen J ^a  

^a LINKÖPING UNIVERSITY   (Sweden)

^b SECO TOOLS AB   (Sweden)

Author keywords

Cathodic arc; Hard coatings; Layer formation; Resputtering; Ternary cathodes

Indexed keywords

AS-DEPOSITED FILMS; CATHODIC ARC; CATHODIC ARC DEPOSITION; DEPOSITION FLUXES; ENERGY DISPERSIVE X-RAY SPECTROMETRY; HIGH INCIDENCE; INDUSTRIAL SCALE; LAYER FORMATION; LAYER THICKNESS; NANO-INDENTATION HARDNESS; NORMAL DIRECTION; PHYSICAL MECHANISM; RE-SPUTTERING; ROTATING SUBSTRATES; SI CONTENT; SUB-LAYERS; TERNARY CATHODES; TIC GRAINS;

CATHODES; DEPOSITION; NANOINDENTATION; SILICON; SUBSTRATES; TITANIUM CARBIDE;

HARD COATINGS;

EID: 79952734628     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.surfcoat.2011.02.007     Document Type: Article

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