Moisture-insensitive polycarbosilane films with superior mechanical properties

ACS Applied Materials and Interfaces

Volumn 4, Issue 5, 2012, Pages 2659-2663

  Matsuda, Y ^a   Rathore, J S ^b   Interrante, L V ^c   Dauskardt, R H ^a   Dubois, G ^b  

^a Stanford University   (United States)

^b IBM ALMADEN RESEARCH CENTER   (United States)

^c RENSSELAER POLYTECHNIC INSTITUTE   (United States)

Author keywords

and thin films; dielectrics; hybrid material; mechanical properties; moisture sensitivity; Structure property relationship

Indexed keywords

ELASTIC STIFFNESS; ENERGY APPLICATIONS; HARSH ENVIRONMENT; LOW DIELECTRIC CONSTANTS; MESO-PORES; MOISTURE ATTACK; MOISTURE-SENSITIVITY; ORGANOSILICATE GLASS; POLYCARBOSILANES; POROUS ORGANOSILICATE; SILOXANE BONDS; STRUCTURE PROPERTY RELATIONSHIPS; THERMAL CURING;

DIELECTRIC MATERIALS; GLASS; HYBRID MATERIALS; MECHANICAL PROPERTIES; POLYSILANES;

MOISTURE;

EID: 84861440440     PISSN: 19448244     EISSN: 19448252     Source Type: Journal    
DOI: 10.1021/am300312y     Document Type: Article

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