Properties development during curing of low dielectric-constant spin-on glasses

Materials Research Society Symposium - Proceedings

Volumn 511, Issue , 1998, Pages 33-38

  Cook, Robert F ^a   Liniger, Eric G ^a   Klaus, David P ^a   Simonyi, Eva E ^a   Cohen, Stephan A ^a  

^a IBM RESEARCH   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CURING; ELECTRIC PROPERTIES; MECHANICAL PROPERTIES; PERMITTIVITY; SEMICONDUCTOR DEVICE MANUFACTURE; STRESS CORROSION CRACKING; TEMPERATURE; TENSILE STRESS; THERMAL EXPANSION; THIN FILMS;

MECHANICAL STABILITY; MICROELECTRONIC INTERCONNECTION STRUCTURES; SILSESQUIOXANE; SPIN ON GLASSES; THERMAL EXPANSION MISMATCH;

GLASS;

EID: 0032291667     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-511-33     Document Type: Conference Paper

References (4)