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Volumn 511, Issue , 1998, Pages 33-38
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Properties development during curing of low dielectric-constant spin-on glasses
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Author keywords
[No Author keywords available]
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Indexed keywords
CURING;
ELECTRIC PROPERTIES;
MECHANICAL PROPERTIES;
PERMITTIVITY;
SEMICONDUCTOR DEVICE MANUFACTURE;
STRESS CORROSION CRACKING;
TEMPERATURE;
TENSILE STRESS;
THERMAL EXPANSION;
THIN FILMS;
MECHANICAL STABILITY;
MICROELECTRONIC INTERCONNECTION STRUCTURES;
SILSESQUIOXANE;
SPIN ON GLASSES;
THERMAL EXPANSION MISMATCH;
GLASS;
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EID: 0032291667
PISSN: 02729172
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1557/proc-511-33 Document Type: Conference Paper |
Times cited : (18)
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References (4)
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