Statistical analysis of plating variable effects on the electrical conductivity of electroless copper patterns on paper

ACS Applied Materials and Interfaces

Volumn 4, Issue 5, 2012, Pages 2358-2368

  Zabetakis, Daniel ^a   Dressick, Walter J ^a  

^a NAVAL RESEARCH LABORATORY   (United States)

Author keywords

cellulose; electroless; factorial analysis; Inkjet printing; paper; pattern

Indexed keywords

COLLOIDAL CATALYSTS; CU FILMS; ELECTRICAL CONDUCTIVITY; ELECTROLESS; ELECTROLESS COPPER; FACTORIAL ANALYSIS; H-FACTORS; LINE DIMENSIONS; OPTIMUM CONDITIONS; PAIRWISE INTERACTION; PAPER SUBSTRATE; PATTERN; PRINTED PATTERNS; PROCESS IMPROVEMENT; TWO-LEVEL FACTORIAL DESIGN; VARIABLE EFFECTS;

CELLULOSE; ELECTRIC CONDUCTIVITY; METALLIC FILMS; PLATING;

PAPER;

CELLULOSE; PAPER; PLATING; PRINTING; RESISTIVITY;

EID: 84861429745     PISSN: 19448244     EISSN: 19448252     Source Type: Journal    
DOI: 10.1021/am3006934     Document Type: Article

References (85)

1. Perelaer, J.; Hendriks, C. E.; de Laat, A. W. M.; Schubert, U. S. Nanotechnology 2009, 20 165303
2. Liu, X.; Chang, H.; Li, Y.; Huck, W. T. S.; Zheng, Z. ACS Appl. Mater. Interfaces 2010, 2, 529-535
3. Schwarz, A.; Hakuzimana, J.; Kaczynska, A.; Banaszczyk, J.; Westbroek, P.; McAdams, E.; Moody, G.; Chronis, Y.; Priniotakis, G.; De Mey, G.; Tseles, D.; Langenhove, L. V. Surf. Coat. Technol. 2010, 204, 1412-1418
4. Siegel, A. C.; Phillips, S. T.; Dickey, M. D.; Lu, N.; Suo, Z.; Whitesides, G. M. Adv. Funct. Mater. 2010, 20, 28-35
5. Wang, C.-W.; Yang, M.-H.; Lee, Y.-Z.; Cheng, K. J. Imaging Sci. Technol. 2007, 51, 452-455
6. Perelaer, J.; Klokkenburg, M.; Hendriks, C. E.; Schubert, U. S. Adv. Mater. 2009, 21, 4830-4834
7. Gan, X.; Wu, Y.; Liu, L.; Shen, B.; Hu, W. J. Alloys Compd. 2008, 455, 308-313
8. Guo, R. H.; Jiang, S. Q.; Yuen, C. W. M.; Ng, M. C. F. J. Appl. Electrochem. 2009, 39, 907-912
9. Guo, T.-F.; Chang, S.-C.; Pyo, S.; Yang, Y. Langmuir 2002, 18, 8142-8147
10. Huang, D.; Liao, F.; Molesa, S.; Redinger, D.; Subramanian, V. J. Electrochem. Soc. 2003, 150, G412-G417
11. Wang, J.-Y.; Huo, S.-J.; Cai, W.-B.; Xu, Q.-J. Chem. Lett. 2006, 35, 582-583
12. Gamerith, S.; Klug, A.; Scheiber, H.; Scherf, U.; Moderegger, E.; List, E. J. W. Adv. Funct. Mater. 2007, 17, 3111-3118
13. Perelaer, J.; de Laat, A. W. M.; Hendriks, C. E.; Schubert, U. S. J. Mater. Chem. 2008, 18, 3209-3215
14. Li, D.; Sutton, D.; Burgess, A.; Graham, D.; Calvert, P. D. J. Mater. Chem. 2009, 19, 3719-3724
15. Sridhar, A.; Reiding, J.; Adelaar, H.; Achterhoek, F.; van Dijk, D. J.; Akkerman, R. J. Micromech. Microeng. 2009, 19 085020
16. Tseng, C.-C.; Chang, C.-P.; Sung, Y.; Chen, Y.-C.; Ger, M.-D. Coll. Surf. A 2009, 339, 206-210
17. Woo, K.; Kim, D.; Kim, J. S.; Lim, S.; Moon, J. Langmuir 2009, 25, 429-433
18. Anto, B. T.; Sivaramakrishnan, S.; Chua, L. L.; Ho, P. K. H. Adv. Funct. Mater. 2010, 20, 286-303
19. Tekin, E.; Smith, P. J.; Schubert, U. S. Soft Matter 2008, 4, 703-713
20. Maüaüttaünen, A.; Ihalainen, P.; Pulkkinen, P.; Wang, S.; Tenhu, H.; Peltonen, J. ACS Appl. Mater. Interfaces 2012, 4, 955-964
21. Grouchko, M.; Kamyshny, A.; Magdassi, S. J. Mater. Chem. 2009, 19, 3057-3062
22. Jeong, S.; Woo, K.; Kim, D.; Lim, S.; Kim, J. S.; Shin, H.; Xia, Y.; Moon, J. Adv. Funct. Mater. 2008, 18, 679-686
23. Pulkkinen, P.; Shan, J.; Leppaünen, K.; Kaünsaükoski, A.; Laiho, A.; Jaürn, M.; Tenhu, H. ACS Appl. Mater. Interfaces 2009, 1, 519-525
24. Magdassi, S.; Grouchko, M.; Berezin, O.; Kamyshny, A. ACS Nano 2010, 4, 1943-1948
25. Tai, Y.-L.; Yang, Z.-G. J. Mater. Chem. 2011, 21, 5938-5943
26. Stamm, A. J. Wood and Cellulose Science; The Ronald Press Company: New York, 1964.
27. Hon, D. N.-S. Cellulose 1994, 1, 1-24
28. Kamide, K.; Saito, M. Adv. Polym. Sci. 1987, 83, 1-56
29. Kobayashi, S.; Uyama, H. Macromol. Chem. Phys. 2003, 204, 235-256
30. Zabetakis, D.; Dressick, W. J. ACS Appl. Mater. Interfaces 2009, 1, 4-25
31. Garcia, A.; Polesel-Maris, J.; Viel, P.; Palacin, S.; Berthelot, T. Adv. Funct. Mater. 2011, 21, 2096-2102
32. Bessueille, F.; Gout, S.; Cotte, S.; Goepfert, Y.; Leonard, D.; Romand, M. J. Adhes. 2009, 85, 690-710
33. Shah, P.; Kevrekidis, Y.; Benziger, J. Langmuir 1999, 15, 1584-1587
34. Zabetakis, D.; Loschialpo, P.; Smith, D.; Dinderman, M. A.; Dressick, W. J. Langmuir 2009, 25, 1785-1789
35. Box, G. E. P.; Hunter, W. G.; Hunter, J. S. Statistics for Experimenters: An Introduction to Design, Data Analysis, and Model Building; John Wiley & Sons: New York, 1978.
36. Dinderman, M. A.; Dressick, W. J.; Kostelansky, C. N.; Price, R. R.; Qadri, S. B.; Schoen, P. E. Chem. Mater. 2006, 18, 4361-4368
37. Chen, M.-S.; Dulcey, C. S.; Brandow, S. L.; Leonard, D. N.; Dressick, W. J.; Calvert, J. M.; Sims, C. W. J. Electrochem. Soc. 2000, 147, 2607-2610
38. Dressick, W. J.; Dulcey, C. S.; Brandow, S. L.; Chen, M.-S.; Leonard, D. N.; Calvert, J. M.; Sims, C. W. In Electrochemical Technology Applications in Electronics-III (Proceedings of the 1999 Joint International Meeting of the Electrochemical Society); Romankiw, L. T.; Osaka, T.; Yamazaki, Y.; Madore, C., Eds.; The Electrochemical Society: Pennington, NJ, 2000; Vol. 99, p 179-187.
39. Bindra, P.; White, J. R. In Electroless Plating-Fundamentals and Applications; Mallory, G. O.; Hajdu, J. B., Eds.; American Electroplaters and Surface Finishers Society: Orlando, FL, 1990, p 289-329.
40. Zabetakis, D.; Dinderman, M.; Schoen, P. Adv. Mater. 2005, 17, 734-738
41. Souguir, Z.; Dupont, A.-L.; d'Espinose de Lacaillerie, J.-B.; Lavdrine, B.; Cheradame, H. Biomacromolecules 2011, 12, 2082-2091
42. Lamminmaüki, T.; Kettle, J.; Rautkoski, H.; Kokko, A.; Gane, P. Ind. Eng. Chem. Res. 2011, 50, 7251-7263
43. Sehaqui, H.; Liu, A.; Zhou, Q.; Berglund, L. A. Biomacromolecules 2010, 11, 2195-2198
44. Griffiths, D. In Introduction to Electrodynamics; 3 rd ed.; Reeves, A., Ed.; Prentice-Hall: Upper Saddle River, NJ, 1999, p 286.
45. Dressick, W. J.; Dulcey, C. S.; Georger, J. H.; Calabrese, G. S.; Calvert, J. M. J. Electrochem. Soc. 1994, 141, 210-220
46. Brandow, S. L.; Chen, M.-S.; Wang, T.; Dulcey, C. S.; Calvert, J. M.; Bohland, J. F.; Calabrese, G. S.; Dressick, W. J. J. Electrochem. Soc. 1997, 144, 3425-3434
47. Jacobs, J. W. M.; Rikken, J. M. G. J. Electrochem. Soc. 1988, 135, 2822-2827
48. van der Putten, A. M. T.; de Bakker, J. W. G. J. Electrochem. Soc. 1993, 140, 2221-2228
49. van der Putten, A. M. T.; de Bakker, J. W. G. J. Electrochem. Soc. 1993, 140, 2229-2235
50. Zhang, S.; Debaets, J.; Vereeken, M.; Vervaet, A.; van Claster, A. J. Electrochem. Soc. 1999, 146, 2870-2875
51. O'Sullivan, E. J. In Electrochemical Technology Applications in Electronics III (Proceedings of the 1999 Joint International Meeting of the Electrochemical Society); Romankiw, L. T.; Osaka, T.; Yamazaki, Y.; Madore, C., Eds.; Electrochemical Society: Pennington, NJ, 2000; Vol. 99, pp 159-171.
52. Ikeda, A.; Saeki, T.; Sakamoto, A.; Sugimoto, Y.; Kimiya, Y.; Fukunaga, Y.; Hattori, R.; Kuriyaki, H.; Kuroki, Y. IEEE Trans. Compon. Packag. Technol. 2007, 30, 494-499
53. Henriksson, M.; Berglund, L. A.; Isaksson, P.; Lindstroüm, T.; Nishino, T. Biomacromolecules 2008, 9, 1579-1585
54. Nogi, M.; Iwamoto, S.; Nakagaito, A. N.; Yano, H. Adv. Mater. 2009, 21, 1595-1598
55. de Mesquita, J. P.; Donnici, C. L.; Pereira, F. V. Biomacromolecules 2010, 11, 473-480
56. Fernandes, S. C. M.; Freire, C. S. R.; Silvestre, A. J. D.; Neto, C. P.; Gandini, A.; Berglund, L. A.; Salmén, L. Carbohydr. Polym. 2010, 81, 394-401
57. Schmitt, F.; Granet, R.; Sarrazin, C.; Mackenzie, G.; Krausz, P. Carbohydr. Polym. 2011, 86, 362-366
58. Wang, H. F.; Zhang, L. M. Prog. Chem. 2010, 22, 2165-2172
59. Pardal, A. C.; Ramos, S. S.; Santos, L.; Almeida, P. Color. Technol. 2001, 117, 43-48
60. Yang, C. Q.; Wei, W. S.; Lickfield, G. C. Text. Res. J. 2000, 70, 143-147
61. Zhou, Y. J.; Luner, P.; Caluwe, P. J. Appl. Polym. Sci. 1995, 58, 1523-1534
62. Warren, J.; Reid, J. D.; Hamalainen, C. Text. Res. J. 1952, 22, 584-591
63. Welsh, E. R.; Schauer, C. L.; Santos, J. P.; Price, R. R. Langmuir 2004, 20, 1807-1811
64. Obokata, T.; Isogai, A. Nord. Pulp Paper Res. J. 2009, 24, 135-140
65. Xu, G. G.; Yang, C. Q.; Deng, Y. L. J. Appl. Polym. Sci. 2004, 93, 1673-1680
66. Fernandes, S. C. M.; Freire, C. S. R.; Silvestre, A. J. D.; Desbrires, J.; Gandini, A.; Neto, C. P. Ind. Eng. Chem. Res. 2010, 49, 6432-6438
67. Dressick, W. J.; Kondracki, L. M.; Chen, M.-S.; Brandow, S. L.; Matijević, E.; Calvert, J. M. Colloids Surf. A 1996, 108, 101-111
68. Dressick, W. J.; Dulcey, C. S.; Chen, M.-S.; Calvert, J. M. Thin Solid Films 1996, 284, 568-572
69. Chen, M.-S.; Dulcey, C. S.; Chrisey, L. A.; Dressick, W. J. Adv. Funct. Mater. 2006, 16, 774-783
70. Brandow, S. L.; Chen, M.-S.; Fertig, S. J.; Chrisey, L. A.; Dulcey, C. S.; Dressick, W. J. Chem.-Eur. J. 2001, 7, 4495-4499
71. Dressick, W. J.; Chen, M.-S.; Brandow, S. L.; Rhee, K. W.; Shirey, L. M.; Perkins, F. K. Appl. Phys. Lett. 2001, 78, 676-678
72. Dressick, W. J.; Dulcey, C. S.; Brandow, S. L.; Witschi, H.; Neeley, P. F. J. Vac. Sci. Technol. A 1999, 17, 1432-1440
73. Dressick, W. J.; Calvert, J. M. Jpn. J. Appl. Phys. Part 1 1993, 32, 5829-5839
74. Martin, B. D.; Brandow, S. L.; Dressick, W. J.; Schull, T. L. Langmuir 2000, 16, 9944-9946
75. Chen, M.-S.; Brandow, S. L.; Schull, T. L.; Chrisey, D. B.; Dressick, W. J. Adv. Funct. Mater. 2005, 15, 1364-1375
76. Demirel, M. C.; Cetinkaya, M.; Singh, A.; Dressick, W. J. Adv. Mater. 2007, 19, 4495-4499
77. Lee, S. B.; Koepsel, R. R.; Morley, S. W.; Matyjaszewski, K.; Sun, Y.; Russell, A. J. Biomacromolecules 2004, 5, 877-882
78. Suh, S. W.; Lee, Y. S.; Park, B. K.; Kim, D. S. Jpn. J. Appl. Phys., Part 2 2010, 05EA06
79. Peng, C.; Lo, S. H. Y.; Wan, C.-C.; Wang, Y.-Y. Colloids Surf., A 2007, 308, 93-99
80. Lan, J.-L.; Wan, C.-C.; Wang, Y.-Y. J. Electrochem. Soc. 2008, 155, K77-K83
81. Aldakov, D.; Bonnassieux, Y.; Geffroy, B.; Palacin, S. ACS Appl. Mater. Interfaces 2009, 1, 584-589
82. Li, J.; O'Keefe, M. J.; O'Keefe, T. J. Surf. Coat. Technol 2011, 205, 3134-3140
83. Sawhney, A.; Agrawal, A.; Lo, T.-C.; Patra, P. K.; Chen, C. H.; Calvert, P. AATCC Rev 2007, 7, 42-46
84. Bidoki, S. M.; McGorman, D.; Lewis, D. M.; Clark, M.; Horler, G.; Miles, R. E. AATCC Rev. 2005, 5, 11-14
85. Bidoki, S. M.; Lewis, D. M.; Clark, M.; Vakorov, A.; Millner, P. A.; McGorman, D. J. Micromech. Microeng 2007, 17, 967-974