Localized ligand induced electroless plating (LIEP) process for the fabrication of copper patterns onto flexible polymer substrates

Advanced Functional Materials

Volumn 21, Issue 11, 2011, Pages 2096-2102

  Garcia, Alexandre ^a   Polesel Maris, Jérôme ^b   Viel, Pascal ^a   Palacin, Serge ^a   Berthelot, Thomas ^a  

^a CNRS UMR 3299   (France)

^b les Atomes et les Molecules   (France)

Author keywords

copper seed layers; poly(ethylene terephtalate); polymer metallization; polyvinylidene fluoride

Indexed keywords

BULK VALUE; CHELATING POLYMER; COPPER IONS; COPPER PATTERN; COPPER SEED; COST EFFECTIVE; COVALENT GRAFTING; DIRECT PRINTING; ECOLOGICAL BENEFITS; ELECTRICAL PROPERTY; ELECTROLESS COPPER; FLEXIBLE POLYMER SUBSTRATES; FLEXIBLE POLYMERS; FLEXIBLE SUBSTRATE; HOST POLYMERS; IN-SITU; LASER PRINTERS; LITHOGRAPHIC METHODS; MECHANICAL DEFORMATION; PATTERNING METHODS; PLASTIC ELECTRONICS; POLY(ACRYLIC ACID ); POLY(ETHYLENE TEREPHTALATE); POLYMER METALLIZATION; POLYMER SUBSTRATE; POLYMER SURFACES; POLYVINYLIDENE FLUORIDES; SEED LAYER; SIMPLE METHOD; SMOOTH SURFACE; STANDARD PHOTOLITHOGRAPHY; WORK FOCUS;

CARBOXYLIC ACIDS; COPPER; COST EFFECTIVENESS; ECOLOGY; ELECTRIC PROPERTIES; ELECTROLESS PLATING; ETHYLENE; FABRICATION; GRAFTING (CHEMICAL); LIGANDS; METAL IONS; PHOTORESISTS; POLYMER FILMS; POLYMERS; SUBSTRATES;

COPPER COMPOUNDS;

EID: 79957939011     PISSN: 1616301X     EISSN: 16163028     Source Type: Journal    
DOI: 10.1002/adfm.201100041     Document Type: Article

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