Localized ligand induced electroless plating (LIEP) process for the fabrication of copper patterns onto flexible polymer substrates

Advanced Functional Materials

Volumn 21, Issue 11, 2011, Pages 2096-2102

  Garcia, Alexandre ^a   Polesel Maris, Jérôme ^b   Viel, Pascal ^a   Palacin, Serge ^a   Berthelot, Thomas ^a  

^a Laboratoire d Electronique Moléculaire   (France)

^b NONE   (France)

Author keywords

copper seed layers; poly(ethylene terephtalate); polymer metallization; polyvinylidene fluoride

Indexed keywords

BULK VALUE; CHELATING POLYMER; COPPER IONS; COPPER PATTERN; COPPER SEED; COST EFFECTIVE; COVALENT GRAFTING; DIRECT PRINTING; ECOLOGICAL BENEFITS; ELECTRICAL PROPERTY; ELECTROLESS COPPER; FLEXIBLE POLYMER SUBSTRATES; FLEXIBLE POLYMERS; FLEXIBLE SUBSTRATE; HOST POLYMERS; IN-SITU; LASER PRINTERS; LITHOGRAPHIC METHODS; MECHANICAL DEFORMATION; PATTERNING METHODS; PLASTIC ELECTRONICS; POLY(ACRYLIC ACID ); POLY(ETHYLENE TEREPHTALATE); POLYMER METALLIZATION; POLYMER SUBSTRATE; POLYMER SURFACES; POLYVINYLIDENE FLUORIDES; SEED LAYER; SIMPLE METHOD; SMOOTH SURFACE; STANDARD PHOTOLITHOGRAPHY; WORK FOCUS;

CARBOXYLIC ACIDS; COPPER; COST EFFECTIVENESS; ECOLOGY; ELECTRIC PROPERTIES; ELECTROLESS PLATING; ETHYLENE; FABRICATION; GRAFTING (CHEMICAL); LIGANDS; METAL IONS; PHOTORESISTS; POLYMER FILMS; POLYMERS; SUBSTRATES;

COPPER COMPOUNDS;

EID: 79957939011     PISSN: 1616301X     EISSN: 16163028     Source Type: Journal    
DOI: 10.1002/adfm.201100041     Document Type: Article

References (54)

1. D. Zabetakis, W. J. Dressick, ACS Appl. Mater. Interfaces 2009, 1, 4.
2. B. L. Hassler, T. J. Amundsen, J. G. Zeikus, I. Lee, R. M. Worden, Biosens. Bioelectron. 2008, 23, 1481.
3. N. Kohli, B. L. Hassler, L. Parthasarathy, R. J. Richardson, R. Y. Ofoli, R. M. Worden, I. Lee, Biomacromolecules 2006, 7, 3327.
4. L. A. Bottomley, Anal. Chem. 1998, 70, 425R.
5. X. Q. Liu, H. X. Chang, Y. Li, W. T. S. Huck, Z. J. Zheng, ACS Appl. Mater. Interfaces 2010, 2, 529.
6. Y. N. Li, Y. L. Wu, B. S. Ong, J. Am. Chem. Soc. 2005, 127, 3266.
7. T. Someya, T. Sekitani, S. Iba, Y. Kato, H. Kawaguchi, T. Sakurai, Proc. Natl. Acad. Sci. U. S. A. 2004, 101, 9966.
8. Z. H. Nie, E. Kumacheva, Nat. Mater. 2008, 7, 277.
9. J. H. Moon, J. Ford, S. Yang, Polym. Adv. Technol. 2006, 17, 83.
10. L. Yang, A. Rida, R. Vyas, M. M. Tentzeris, IEEE Trans. Microwave Theory Tech 2007, 55, 2894.
11. F. Bessueille, S. Gout, S. Cotte, Y. Goepfert, D. Leonard, M. Romand, J. Adhes. 2009, 85, 690.
12. S. Busato, A. Belloli, P. Ermanni, Sens. Actuators, B 2007, 123, 840.
13. K. Cheng, M. H. Yang, W. W. W. Chiu, C. Y. Huang, J. Chang, T. F. Ying, Y. Yang, Macromol. Rapid Commun. 2005, 26, 247.
14. B. J. de Gans, P. C. Duineveld, U. S. Schubert, Adv. Mater. 2004, 16, 203.
15. D. P. Li, D. Sutton, A. Burgess, D. Graham, P. D. Calvert, J. Mater. Chem. 2009, 19, 3719.
16. H. Sirringhaus, T. Kawase, R. H. Friend, T. Shimoda, M. Inbasekaran, W. Wu, E. P. Woo, Science 2000, 290, 2123.
17. C. C. Tseng, C. P. Chang, Y. Sung, Y. C. Chen, M. D. Ger, Colloids Surf., A 2009, 339, 206.
18. D. Aldakov, Y. Bonnassieux, B. Geffroy, S. Palacin, ACS Appl. Mater. Interfaces 2009, 1, 584.
19. D. J. Garrett, J. Lehr, G. M. Miskelly, A. J. Downard, J. Am. Chem. Soc. 2007, 129, 15456.
20. S. C. Huang, T. C. Tsao, L. J. Chen, J. Electrochem. Soc. 2010, 157, D222.
21. W. Prissanaroon, N. Brack, P. J. Pigram, P. Hale, P. Kappen, J. Liesegang, Thin Solid Films 2005, 477, 131.
22. M. S. Miller, H. L. Filiatrault, G. J. E. Davidson, M. Luo, T. B. Carmichael, J. Am. Chem. Soc. 2010, 132, 765.
23. Y. N. Xia, G. M. Whitesides, Annu. Rev. Mater. Sci. 1998, 28, 153.
24. D. Qin, Y. N. Xia, G. M. Whitesides, Nat. Protoc. 2010, 5, 491.
25. F. C. Krebs, Sol. Energy Mater. Sol. Cells 2009, 93, 394.
26. A. Garcia, T. Berthelot, P. Viel, A. Mesnage, P. Jegou, F. Nekelson, S. Roussel, S. Palacin, ACS Appl. Mater. Interfaces 2010, 2, 1177.
27. A. Garcia, T. Berthelot, P. Viel, J. Polesel-Maris, S. Palacin, ACS Appl. Mater. Interfaces 2010, 2, 3043.
28. T. Berthelot, A. Garcia, P. Viel, S. Roussel, France Patent WO2010125189, 2010.
29. V. Mévellec, S. Roussel, G. Deniau, France Patent WO2008078052, 2006.
30. V. Mévellec, S. Roussel, L. Tessier, J. Chancolon, M. Mayne-L'Hermite, G. Deniau, P. Viel, S. Palacin, Chem. Mater. 2007, 19, 6323.
31. M. Brandes, C. C. Fels, Metal Finishing 2008, 106, 21.
32. J. R. Lancaster, J. Jehani, G. T. Carroll, Y. Chen, N. J. Turro, J. T. Koberstein, Chem. Mater. 2008, 20, 6583.
33. G. O. Mallory, J. B. Hajdu, ELECTROLESS PLATING: Fundamentals and Applications, The American Electroplaters and Surface Finishers Society, Washington, D.C. 1990.
34. A. M. Mance, J. Electrochem. Soc. 1992, 139, 724.
35. G. X. Wang, N. Li, H. L. Hu, Y. C. Yu, Appl. Surf. Sci. 2006, 253, 480.
36. T. Berthelot, A. Garcia, X. T. Le, J. El Morsli, P. Jégou, S. Palacin, P. Viel, Appl. Surf. Sci. 2010, doi:10.1016/j.apsusc.2010.11.071.
37. Y. X. Lu, Appl. Surf. Sci. 2010, 256, 3554.
38. Y. X. Lu, S. H. Jiang, Y. M. Huang, Surf. Coat. Technol. 2010, 204, 2829.
39. X. P. Gan, Y. T. Wu, L. Liu, B. Shen, W. B. Hu, J. Alloys Compd. 2008, 455, 308.
40. S. L. Favaro, A. F. Rubira, E. C. Muniz, E. Radovanovic, Polym. Degrad. Stab. 2007, 92, 1219.
41. E. G. Han, E. A. Kim, K. W. Oh, Synth. Met. 2001, 123, 469.
42. S. C. Domenech, E. Lima, V. Drago, J. C. De Lima, N. G. Borges, A. O. V. Avila, V. Soldi, Appl. Surf. Sci. 2003, 220, 238.
43. K. W. Oh, D. J. Kim, S. H. Kim, J. Appl. Polym. Sci. 2002, 84, 1369.
44. M. Pascu, D. Debarnot, F. Poncin-Epaillard, G. G. Bumbu, S. Cimmino, C. Vasile, J. Phys. D-Appl. Phys. 2006, 39, 2224.
45. M. D. Stewart, K. Patterson, M. H. Somervell, C. G. Willson, J. Phys. Org. Chem. 2000, 13, 767.
46. D. P. Sanders, Chem. Rev. 2010, 110, 321.
47. B. D. Gates, Q. B. Xu, M. Stewart, D. Ryan, C. G. Willson, G. M. Whitesides, Chem. Rev. 2005, 105, 1171.
48. C. G. Willson, B. J. Roman, ACS Nano 2008, 2, 1323.
49. G. Beamson, D. Briggs, High Resolution XPS of Organic Polymers: The Scienta ESCA300, John Wiley & Sons, New York 1992.
50. R. C. Weast, CRC Handbook of Chemistry and Physics, CRC Press, Boca Raton 1984.
51. S. L. Brandow, W. J. Dressick, C. R. K. Marrian, G. M. Chow, J. M. Calvert, J. Electrochem. Soc. 1995, 142, 2233.
52. D. M. Brewis, I. Mathieson, I. Sutherland, R. A. Cayless, R. H. Dahm, Int. J. Adhes. Adhes. 1996, 16, 87.
53. E. Menard, M. A. Meitl, Y. G. Sun, J. U. Park, D. J. L. Shir, Y. S. Nam, S. Jeon, J. A. Rogers, Chem. Rev. 2007, 107, 1117.
54. Keithley, Low Level Measurements Handbook, Keithley Instruments, Cleveland 2007.