Electroless plating of Cu-Ni-P alloy on PET fabrics and effect of plating parameters on the properties of conductive fabrics

Journal of Alloys and Compounds

Volumn 455, Issue 1-2, 2008, Pages 308-313

  Gan, Xueping ^a   Wu, Yating ^a   Liu, Lei ^a   Shen, Bin ^a   Hu, Wenbin ^a  

^a SHANGHAI JIAO TONG UNIVERSITY   (China)

Author keywords

Crystal structure; Cu Ni P alloy; Deposition rate; Electroless plating; PET fabric; Shielding effectiveness; Surface morphology; Surface resistance

Indexed keywords

CRYSTAL STRUCTURE; ELECTROLESS PLATING; POLYETHYLENE TEREPHTHALATES; SURFACE MORPHOLOGY; SURFACE RESISTANCE;

DEPOSITION RATE; SHIELDING EFFECTIVENESS;

COPPER ALLOYS;

EID: 41049084658     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2007.01.054     Document Type: Article

References (23)

1. Ott H.W. Noise Reduction Techniques in Electronic Systems. second ed. (1988), John Wiley & Sons
2. Paul C.R. Introduction to Electromagnetic Compatibility. second ed. (1992), John Wiley & Sons
3. Huang C.Y., Mo W.W., and Roan M.L. Surf. Coat. Technol. 184 (2004) 163-169
4. Zhao F. Mater. Dev. Applic. 16 5 (2001) 29-34 (in Chinese)
5. Wang J. New Chem. Mater. 30 7 (2002) 16-19 (in Chinese)
6. Han E.G., Oh K.W., and Kim E.A. J. Korean Soc. Clothing Textiles 23 5 (1995) 694-698
7. Han E.G., Kim E.A., and Oh K.W. Synth. Met. 123 (2001) 469-476
8. Zhang B., Li G., and Zhai J. J. Environ. Eng. 13 3 (1995) 38-39 (in Chinese)
9. Chen W., Yao Y., and Yu Z. J. Zhejiang Sichou Inst. Technol. 15 4 (1998) 265-270 (in Chinese)
10. Li J., and Kohl P.A. J. Electrochem. Soc. 150 8 (2003) 558-562
11. Cheng D.H., Xu W.Y., Zhang Z.Y., et al. Met. Finish. 95 1 (1997) 34-37
12. Li J., and Kohl P.A. J. Electrochem. Soc. 149 12 (2002) 631-636
13. Li J., Hayden H., and Kohl P.A. Electrochim. Acta 49 (2004) 1789-1795
14. Hung A. Plat. Surf. Finish. 75 1 (1988) 62-65
15. Hung A., and Ohno I. J. Electrochem. Soc. 137 3 (1990) 918-921
16. Hung A., and Chen K.M. J. Electrochem. Soc. 136 1 (1989) 72-75
17. Hung A. J. Electrochem. Soc. 132 5 (1985) 1047-1049
18. Hung A. J. Electrochem. Soc. 133 7 (1986) 1350-1353
19. Simon R.M., and Stutz D. EMC Technol. 2 4 (1983) 39-48
20. Hewlett-Packard Co., HP 8752 operation manual, performance tests 1996, pp. 4-36.
21. Paul C.R. Introduction to Electromagnetic Compatibility (1992), Wiley, New York p. 650
22. Tzeng S.S., and Chang F.Y. Thin Solid Films 388 (2001) 143-149
23. Bernhard K. Principles of Electromagnetic Compatibility (1979), Artech House, Dedham, MA