Vertically integrated electronic circuits via a combination of self-assembled polyelectrolytes, ink-jet printing, and electroless metal plating processes

Langmuir

Volumn 18, Issue 21, 2002, Pages 8142-8147

  Guo, Tzung Fang ^a   Chang, Shun Chi ^a   Pyo, Seungmoon ^a   Yang, Yang ^a  

^a UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

METAL PLATING PROCESSES;

DEPOSITION; ELECTROLESS PLATING; INTEGRATED CIRCUIT MANUFACTURE; MULTILAYERS; PHOTOLITHOGRAPHY; SURFACE PROPERTIES;

POLYELECTROLYTES;

EID: 0037109754     PISSN: 07437463     EISSN: None     Source Type: Journal    
DOI: 10.1021/la0257889     Document Type: Article

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