Uniformity of an electroless plated Ni on a pad connected to different size pads or a Pn junction for under bump metallurgy in a flip-chip assembly

IEEE Transactions on Components and Packaging Technologies

Volumn 30, Issue 3, 2007, Pages 494-499

  Ikeda, Akihiro ^a   Saeki, Tsubasa ^a   Sakamoto, Atsushi ^a   Sugimoto, Yosuke ^b   Kimiya, Yasuhiro ^c   Fukunaga, Fukunaga ^c   Hattori, Reiji ^a   Kuriyaki, Hisao ^a   Kuroki, Yukinori ^a  

^a KYUSHU UNIVERSITY   (Japan)

^b KYUSHU ELECTRIC POWER CO INC   (Japan)

^c Yoshitama Surface Finishing Co Ltd   (Japan)

Author keywords

Electroless Ni; Pad size; Pn junction; Under bump metallurgy (UBM); Uniformity

Indexed keywords

ELECTROLESS NI; PAD SIZE; PN JUNCTION; UNDER BUMP METALLURGY (UBM); UNIFORMITY;

ANODIC OXIDATION; ELECTRIC CONNECTORS; ELECTRONS; FLIP CHIP DEVICES; LEAD; METALLURGY; ORES; SEMICONDUCTING SILICON COMPOUNDS; SILICON; SURFACE REACTIONS;

NICKEL;

EID: 65449135150     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2007.901675     Document Type: Article

References (14)

1. J. W. Jang, D. R. Frear, T. Y. Lee, and K. N. Tu, "Morphology of interfacial reaction between lead-free solders and electroless Ni-P under bump metallization," J. Appl. Phys., vol. 88, no. 11, pp. 6359-6363, Dec. 2000.
2. M. O. Alam, Y. C. Chan, and K. C. Hung, "Reliability study of the electroless Ni-P layer against solder alloy," Microelectron. Rel. vol. 42, no. 7, pp. 1065-1073, Jul. 2002.
3. T. Y. Lee, K. N. Tu, and D. R. Frear, "Electromigration of eutectic SnPb and SnAg3.8Cu0.7 flip chip solder bumps and under-bump metallization," J. Appl. Phys., vol. 90, no. 9, pp. 4502-4508, Nov. 2001.
4. J. W. Jang, P. G. Kim, K. N. Tu, D. R. Frear, and P. Thompson, "Solder reaction-assisted crystallization of electroless Ni-P under bump metallization in low cost flip chip technology," J. Appl. Phys., vol. 85, no. 12, pp. 8456-8463, Jun. 1999.
5. M. J. Yim, Y. D. Jeon, and K. W. Paik, "Reduced thermal strain in flip chip assembly on organic substrate using low CTE anisotropic conductive film," IEEE Trans. Electron. Packag. Manufact., vol. 23, no. 3, pp. 171-176, Jul. 2000.
6. M. J. Yim, W. Kwon, and K. W. Paik, "Effect of filler content on the dielectric properties of anisotropic conductive adhesives materials for high-frequency flip-chip interconnection," Mater. Sci. Eng. B-Solid State Mater. Adv. Technol., vol. 126, no. 1, pp. 59-65, Jan. 2006.
7. M. J. Yim, I. H. Jeong, H. K. Choi, J. S. Hwang, J. Y. Ahn, W. Kwon, and K. W. Paik, "Flip chip interconnection with anisotropic conductive adhesives for RF and high-frequency applications," IEEE Trans. Comp. Packag. Technol., vol. 28, no. 4, pp. 789-796, Dec. 2005.
8. A. H. Gafin and S. W. Orchard, "Current potential relationships for the half-reactions in two electroless nickel plating baths using the quartz crystal microbalance electrode," J. Appl. Electrochem., vol. 22, no. 9, pp. 830-834, Sep. 1992.
9. P. Bindra and J. Roldan, "Mechanisms of electroless metal plating: 3. Mixed potential theory and the interdependence of partial reactions," J. Appl. Electrochem., vol. 17, no. 6, pp. 1254-1266, Nov. 1987.
10. S. Zhang, Z. J. De Baets, M. Vereeken, A. Vervaet, and A. Van Calster, "Stabilizer concentration and local environment: Their effects on electroless nickel plating of PCB micropads," J. Electrochem. Soc. vol. 146, no. 8, pp. 2870-2875, Aug. 1999.
11. S. Siau, A. Vervaet, L. Degrendele, J. D. Baets, and A. V. Calster, "Qualitative electroless Ni/Au plating considerations for the solder mask on top of sequential build-up layers," Appl. Surf. Sci., vol. 252, no. 8, pp. 2717-2740, Feb. 2006.
12. Y. S. Kim and H. J. Sohn, "Mathematical modeling of electroless nickel deposition at steady state using rotating disk electrode," J. Electrochem. Soc., vol. 143, no. 2, pp. 505-509, Feb. 1996.
13. J. E. A. M. Van Den Meerakker, "On the mechanism of electroless plating: 2. One mechanism for different reductants," J. Appl. Electrochem., vol. 11, pp. 395-400, May 1981.
14. S. M. Sze, Physics of Semiconductor Devices, 2nd ed. New York: Wiley, 1981, pp. 35-37.