Assembly of ultra-thin chip packages (UTCPs) for enhanced flexibility of flexible displays

Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC

Volumn , Issue , 2008, Pages 309-313

  Govaerts, Jonathan ^a   Vanfleteren, Jan ^a  

^a GHENT UNIVERSITY   (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

FLEXIBLE DISPLAYS; FLEXIBLE SUBSTRATES; LOW-TEMPERATURE CURING; SET-UPS; THIN CHIPS;

CONDUCTIVE FILMS;

EID: 58149100774     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESTC.2008.4684367     Document Type: Conference Paper

References (4)

1. W. Christiaens, B. Vandevelde, E. Bosman and J. Vanfleteren, "UTCP: 60 um thick bendable chip package", Proceedings of IWLPS (San Jose), November 2006.
2. J. Govaerts, W. Christiaens, E. Bosman and J. Vantleteren, "Fabrication Processes for Embedding Thin Chips in Flat Flexible Substrates", IEEE Transactions on Advanced Packaging, under review (proposed January 2008).
3. J. Govaerts, B. Vandecasteele and J. Vantleteren, "Interconnecting Drivers to Flexible Displays", Journal of the Society for Information Display, accepted for publication (as of March 2008).
4. I. French, "EPLaR and FlexiDis", FlexiDis Newsletter no 3, p.6 (downloadable from http://www.tlexidisproject.org)