Room-temperature chip-stack interconnection using compliant bumps and wedge-incorporated electrodes

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2010, Pages 1763-1768

  Watanabe, Naoya ^a   Asano, Tanemasa ^a  

^a KYUSHU UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

AMBIENT AIR; AU CONE; COMPLIANT BUMP; EDGE STRUCTURES; HIGH-DENSITY; INTER-CHIP; PRESSING LOADS; ROOM TEMPERATURE;

ELECTRODES;

EID: 77955190388     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2010.5490730     Document Type: Conference Paper

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