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Japanese Journal of Applied Physics

Volumn 50, Issue 6 PART 2, 2011, Pages

Microjoining of LSI chips on poly(ethylene naphthalate) using compliant bump

(5) Shuto, Takanori a Watanabe, Naoya a Ikeda, Akihiro a Higashimachi, Takao b Asano, Tanemasa a

a KYUSHU UNIVERSITY (Japan)

b SOJO UNIVERSITY (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

AU BUMP; COMPLIANT BUMP; COUNTER ELECTRODES; LAYERED STRUCTURES; LSI CHIPS; MECHANICAL ANALYSIS; MICRO-JOINING; PEN FILM; POLYETHYLENE NAPHTHALATE; SI WAFER;

ELECTROLESS PLATING; ETHYLENE; FINITE ELEMENT METHOD; FLEXIBLE ELECTRONICS; GLASS TRANSITION; GOLD COATINGS; PHOTOLITHOGRAPHY; SEMICONDUCTING SILICON COMPOUNDS; SILICON WAFERS;

GOLD;

EID: 79959386450 PISSN: 00214922 EISSN: 13474065 Source Type: Journal
DOI: 10.1143/JJAP.50.06GM05 Document Type: Article

Times cited : (7)

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