Analysis of adhesion and fracture energy of nano-particle silver in electronics packaging applications

IEEE Transactions on Advanced Packaging

Volumn 33, Issue 1, 2010, Pages 48-57

  Joo, Sung Chul ^a   Baldwin, Daniel F ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

Adhesion; Button shear; Die shear; Electronics packaging; Interfacial bond strength; Interfacial fracture; Interfacial fracture energy; Nano particle silver

Indexed keywords

BUTTON SHEAR; INTERFACIAL BOND STRENGTH; INTERFACIAL FRACTURE; INTERFACIAL FRACTURE ENERGY; NANO-PARTICLE SILVER; SHEAR DIE;

ADHESION; AUTOMOBILE SEATS; BINDERS; BOND STRENGTH (MATERIALS); BUTENES; CONDUCTIVE FILMS; DIES; ELECTRONICS PACKAGING; FRACTURE; FRACTURE ENERGY; INK; INORGANIC COATINGS; LIQUID CRYSTALS; METAL CLADDING; NANOPARTICLES; PACKAGING; POLYIMIDES; POLYMER FILMS; TESTING; THICK FILMS;

SILVER;

EID: 77949262355     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2009.2033809     Document Type: Article

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