Microstructure characteristic, mechanical properties and sintering mechanism of nanocrystalline copper obtained by SPS process

Materials Science and Engineering: A

Volumn 523, Issue 1-2, 2009, Pages 134-138

  Zhang, Z H ^a   Wang, F C ^a   Lee, S K ^a   Liu, Y ^a   Cheng, J W ^a   Liang, Y ^a  

^a BEIJING INSTITUTE OF TECHNOLOGY   (China)

Author keywords

Mechanical properties; Microstructure characteristic; Nanocrystalline copper; Sintering mechanism; Spark plasma sintering

Indexed keywords

COPPER POWDER; DENSITY (SPECIFIC GRAVITY); MICROSTRUCTURE; NITROGEN COMPOUNDS; SPARK PLASMA SINTERING;

AVERAGE SIZE; CHEMICAL REDUCTION METHODS; MICROSTRUCTURE CHARACTERISTICS; NANO SIZED; NANOCRYSTALLINE COPPER; RELATIVE DENSITY; SINTERING MECHANISM; SINTERING TEMPERATURES; SPARK-PLASMA-SINTERING; SPARK-PLASMA-SINTERING-PROCESS;

NANOCRYSTALS;

EID: 68949172401     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2009.07.016     Document Type: Article

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