Die-attach for high-temperature applications using fineplacer-pressure- sintering (FPS)

Electronics System Integration Technology Conference, ESTC 2010 - Proceedings

Volumn , Issue , 2010, Pages

  Kähler, Julian ^a   Heuck, Nicolas ^a   Palm, Gerhard ^a   Stranz, Andrej ^a   Waag, Andreas ^a   Peiner, Erwin ^a  

^a TECHNICAL UNIVERSITY OF BRAUNSCHWEIG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

BARE DIES; BOND STRENGTH; COMPOUND LAYER; ELECTRICAL AND MECHANICAL PROPERTIES; ELECTRONIC COMPONENT; FLIP-CHIP BONDERS; GRAIN SIZE; JOINING TECHNIQUES; METALLIZATIONS; MOLYBDENUM SUBSTRATE; NANOMETRES; POSITIONING ACCURACY; PROCESS TEMPERATURE; SILVER POWDERS;

DIES; ELECTRIC PROPERTIES; GALLIUM NITRIDE; MECHANICAL PROPERTIES; METALLIZING; MOLYBDENUM; ORGANIC POLYMERS; PHOTODIODES; SINTERING; SUBSTRATES;

GALLIUM ALLOYS;

EID: 78651327600     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESTC.2010.5642808     Document Type: Conference Paper

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