Reliability assessment of high temperature lead-free device attach technologies

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2008, Pages 2131-2138

  Quintero, Pedro ^a   Obere, Timothy ^a   McCluskey, Patrick ^a  

^a UNIVERSITY OF MARYLAND   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ACCELERATED THERMAL CYCLING; ELECTRONIC COMPONENTS; HIGH TEMPERATURE;

COMPUTER NETWORKS; ELECTRONICS INDUSTRY; FAILURE ANALYSIS; FATIGUE DAMAGE; KETONES; LEAD; LEAD ALLOYS; PACKAGING MATERIALS; PRODUCT DEVELOPMENT; PROJECT MANAGEMENT; RELIABILITY; SILVER ALLOYS; TECHNOLOGY; TIN; TITANIUM COMPOUNDS;

SILVER;

EID: 51349087826     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2008.4550280     Document Type: Conference Paper

References (19)

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