Metallurgy for SiC die attach for operation at 500°C

International Conference and Exhibition on High Temperature Electronics 2010, HiTEC 2010

Volumn , Issue , 2010, Pages 8-17

  Zheng, Ping ^a   Henson, Phillip ^a   Wayne Johnson, R ^a   Chen, Liangyu ^b  

^a AUBURN UNIVERSITY   (United States)

^b NASA GLENN RESEARCH CENTER   (United States)

Author keywords

Ag migration; Die attach; High temperature; LTP bonding

Indexed keywords

DIE-ATTACH; DIE-ATTACH MATERIALS; FAILURE SURFACE; FILM METALLIZATION; HIGH TEMPERATURE; HIGH-TEMPERATURE DIE-ATTACH; POTENTIAL FAILURES; TRANSIENT PHASE;

DIGITAL STORAGE; GOLD; METALLIZING; METALLURGY; NANOPARTICLES; SILICON CARBIDE; SILVER ALLOYS; SINTERING; SURFACE ANALYSIS; THICK FILMS;

SILVER;

EID: 78651278622     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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