Physical factors determining thermal conductivities of iisotropic conductive adhesives

Journal of Electronic Materials

Volumn 38, Issue 3, 2009, Pages 430-437

  Inoue, Masahiro ^a   Muta, Hiroaki ^a   Maekawa, Takuji ^a   Yamanaka, Shinsuke ^a   Suganuma, Katsuaki ^a  

^a OSAKA UNIVERSITY   (Japan)

Author keywords

Annealing; Curing; Electrically conductive adhesives; Percolation; Thermal conductivity

Indexed keywords

AG PARTICLES; ANNEALING PROCESS; CONDUCTING ELECTRONS; CONDUCTIVE ADHESIVES; ELECTRICAL CONDUCTIONS; ELECTRICAL RESISTIVITIES; ELECTRICALLY CONDUCTIVE ADHESIVES; EXPERIMENTAL VALUES; IN-PLANE DIRECTIONS; ISOTROPIC CONDUCTIVE ADHESIVES; PERCOLATION; PHYSICAL FACTORS; THERMAL HISTORY;

ADHESIVES; ANNEALING; CARBON FIBER REINFORCED PLASTICS; CURING; ELECTRIC RESISTANCE; EPOXY RESINS; HEMODYNAMICS; INDEPENDENT COMPONENT ANALYSIS; PERCOLATION (FLUIDS); SILVER; SINGLE CRYSTALS; SOLVENTS; THERMAL INSULATING MATERIALS; THERMOANALYSIS; THERMODYNAMIC PROPERTIES;

THERMAL CONDUCTIVITY;

EID: 59849123292     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-008-0593-2     Document Type: Article

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