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Volumn 520, Issue 7, 2012, Pages 2554-2561
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Sputter deposition of semicrystalline tin dioxide films
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Author keywords
Amorphous; Electrical properties; Semicrystalline; Sputtering; Tin dioxide; X ray diffraction
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Indexed keywords
AMORPHOUS MATRICES;
COPPER INDIUM GALLIUM DISELENIDE;
CRYSTALLINITIES;
DEPOSITION TEMPERATURES;
DEPOSITION TIME;
DEVICE RELIABILITY;
DIFFRACTION PEAKS;
FEED GAS;
FEED GAS COMPOSITION;
FILM CRYSTALLINITY;
FILM PROPERTIES;
HALL EFFECT MEASUREMENT;
INITIAL DEPOSITIONS;
NANOMETER SIZE;
OXYGEN ADDITION;
OXYGEN CONCENTRATIONS;
POLYCRYSTALLINE;
POLYCRYSTALLINE FILM;
POWDER DIFFRACTION;
ROOM TEMPERATURE;
SEMICRYSTALLINE;
SEMICRYSTALLINES;
SODA LIME GLASS;
SPUTTERING GAS;
SPUTTERING POWER;
SURFACE NORMALS;
TIN DIOXIDE FILM;
WATER PERMEATION;
WIDE BAND GAP;
WINDOW LAYER;
XRD;
AMORPHOUS MATERIALS;
ARGON;
CARRIER CONCENTRATION;
DEPOSITION;
DEPOSITION RATES;
ELECTRIC PROPERTIES;
ELECTRON MOBILITY;
GLASS;
LIME;
OXYGEN;
SELENIUM COMPOUNDS;
SEMICONDUCTING SILICON COMPOUNDS;
SILICON WAFERS;
SPUTTERING;
TIN;
TIN DIOXIDE;
TINNING;
TRANSPORT PROPERTIES;
X RAY DIFFRACTION;
ZINC OXIDE;
AMORPHOUS FILMS;
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EID: 84856391175
PISSN: 00406090
EISSN: None
Source Type: Journal
DOI: 10.1016/j.tsf.2011.10.169 Document Type: Article |
Times cited : (35)
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References (27)
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