Solid-state interfacial reactions at the solder joints employing Au/Pd/Ni and Au/Ni as the surface finish metallizations

Microelectronics Reliability

Volumn 52, Issue 2, 2012, Pages 385-390

  Lin, Chi Pu ^a   Chen, Chih Ming ^a  

^a NATIONAL CHUNG HSING UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

BI-LAYER; CU SUBSTRATE; INTERFACIAL MICROSTRUCTURE; LEAD-FREE; LOW TEMPERATURES; MATRIX; METALLIZATIONS; MULTILAYER STRUCTURES; REFLOW PROCESS; SOLDER JOINTS; SOLID STATE BONDING; SURFACE FINISHES;

FINISHING; GOLD ALLOYS; INTERMETALLICS; METALLIZING; SOLDERING ALLOYS; THERMAL AGING; TIN;

SOLID STATE REACTIONS;

EID: 84855901386     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2011.03.007     Document Type: Article

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