IMC formation between electroless Ni/Pd/Au surface finish and SnAgCu solder

Proceedings, 2008 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2008

Volumn , Issue , 2008, Pages

  Jiwang, Mao ^a   Bin, Liu ^b   Ming, Li ^a   Yu, Wang ^b   Dali, Mao ^a  

^a SHANGHAI JIAO TONG UNIVERSITY   (China)

^b INTEL CORPORATION   (China)

Author keywords

[No Author keywords available]

Indexed keywords

BRAZING; COPPER; ELECTRIC CURRENTS; ELECTROLESS PLATING; ELECTRONICS PACKAGING; SEMICONDUCTING INTERMETALLICS; TECHNOLOGY; WELDING;

BGA PACKAGES; ELECTROLESS; ELECTRONIC PACKAGING; HIGH-DENSITY PACKAGING; INTERFACIAL REACTIONS; INTERNATIONAL CONFERENCES; MORPHOLOGY AND COMPOSITION; SN-AG-CU SOLDER; SURFACE FINISHING;

SURFACE REACTIONS;

EID: 52649134410     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICEPT.2008.4607113     Document Type: Conference Paper

References (7)

1. Kiyotaka Tsukada. "Development of New Surface Finishing Technology for PKG Substrate with High Bondability," Advanced Packaging Materials: Processes, Properties and Interfaces, 2005. Proc. International Symposium on 2005, pp. 110-114.
2. B. Kobe, N.S. McIntyre. "Investigation of reactions between lead/tin solder and palladium surface finishes,"Jcto Materialia, Vol.50, (2002), pp. 4667 - 4676.
3. C.E Ho, Y.W.Lin, S.C. Yang, et al, "Effects of Limited Cu Supply on soldering reactions between SnAgCu and Ni". J. Electron. Mater, Vol.35, No.5 (2006), pp.1017-1024.
4. C.E Ho, et.al "Volume Effect on the soldering Reaction between SnAgCu and Ni". Proc. of 10th Inernational Symposium and Advanced Packing Materials, 2005, pp.39 - 44.
5. Kwang-Lung Lin, Po-Cheng Shih. "IMC formation on BGA package with Sn-Ag-Cu and Sn-Ag-Cu-Ni-Ge solder balls," J. Alloys Compd, Vol.452, No. 2 (2008), pp. 291-297.
6. Dezhi Li, et.al, "Characteristics of intermetallics and micromechanical properties during thermal ageing of Sn-Ag-Cu flip-chip solder interconnects" Mater. Sci. Eng. A ,Vol.391, (2005), pp. 95- 103.
7. Pei Yao, Ping Liu, Jim Liu, "Effects of multiple reflows on intermetallic morphology and shear strength of SnAgCu-xNi composite solder joints on electrolytic Ni/Au metallized substrate," J. Alloys Compd. Vol. 462, No. 1 (2008), pp. 73 - 79.