Room temperature interfacial reactions in electrodeposited Au/Sn couples

Acta Materialia

Volumn 56, Issue 19, 2008, Pages 5818-5827

  Tang, Wenming ^a   He, Anqiang ^a   Liu, Qi ^a   Ivey, Douglas G ^a  

^a UNIVERSITY OF ALBERTA   (Canada)

Author keywords

Au Sn couples; Electrodeposition; Interdiffusion; Microstructure

Indexed keywords

CORROSION; ELECTRODEPOSITION; MICROSTRUCTURE; PHASE INTERFACES; REACTION KINETICS; SEMICONDUCTING SILICON COMPOUNDS; SILICON; SILICON WAFERS; TIN; TIN ALLOYS;

AU/SN COUPLES; INTERDIFFUSION; INTERFACIAL REACTIONS; KIRKENDALL VOIDS; LAYER THICKNESSES; PHASE FORMATIONS; ROOM TEMPERATURES; SI WAFERS;

GOLD;

EID: 54249123560     PISSN: 13596454     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.actamat.2008.08.002     Document Type: Article

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