Gold embrittlement of solder joints in wafer-level chip-scale package on printed circuit board with Ni/Au surface finish

IEEE Transactions on Electronics Packaging Manufacturing

Volumn 31, Issue 3, 2008, Pages 185-191

  Huang, Xingjia ^a   Lee, S W Ricky ^a   Li, Ming ^b   Chen, William T ^c  

^a HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Hong Kong)

^b ASM Pacific Technology Ltd   (Hong Kong)

^c Advanced Semiconductor Engineering Inc   (United States)

Author keywords

Intermetallic compound; Solder joint reliability; Under bump metallization (UBM)

Indexed keywords

BRAZING; COMPUTER OPERATING PROCEDURES; ELECTRONIC EQUIPMENT MANUFACTURE; EMBRITTLEMENT; GOLD; LITHOGRAPHY; PRINTED CIRCUIT BOARDS; PRINTED CIRCUIT MANUFACTURE; RESISTORS; THERMAL AGING;

BRITTLE FAILURES; BULK SOLDERS; CHIP-SCALE-PACKAGE (CSP); REFLOW PROCESS; SOLDER BALLS; SOLDER JOINTS; SURFACE FINISHING; WAFER LEVELS;

WELDING;

EID: 47249091868     PISSN: 1521334X     EISSN: None     Source Type: Journal    
DOI: 10.1109/TEPM.2008.926264     Document Type: Article

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