Study of suitable palladium and gold thickness in ENEPIG deposits for lead free soldering and gold wire bonding

Proceedings - 2008 International Symposium on Microelectronics, IMAPS 2008

Volumn , Issue , 2008, Pages 924-930

  Oda, Yukinori ^a   Kiso, Masayuki ^a   Kurosaka, Seigo ^a   Okada, Akira ^a   Kitajima, Kota ^a   Hashimoto, Shigeo ^a   Milad, George ^a   Gudeczauskas, Don ^a  

^a Central Research Laboratory   (United States)

Author keywords

ENEPIG; Gold wire bonding; Intermetallic; Lead free solder

Indexed keywords

ENEPIG; GOLD WIRE BONDINGS; HIGH RELIABILITY; INTER-METALLIC COMPOUNDS; LEAD FREE SOLDERS; LEAD-FREE SOLDER JOINT; LEAD-FREE SOLDERING; SOLDER JOINT RELIABILITY;

ELECTRONICS PACKAGING; GOLD; GOLD DEPOSITS; INTERMETALLICS; MICROELECTRONICS; SILVER; SOLDERING ALLOYS; TIN;

SOLDERING;

EID: 84876893586     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (3)

1. Chi-Won Hwang, Katsusaki Suganuma. J. Mater. Res., 18, 2540, Nov (2003)
2. th International Symposium on Microelectronics, October 8-12, 2006, San Diego
3. V. Vuorinen, T. Laurila, H. Yu, and J.K. Kivilahti. J. Appl. Phys.99, 023530 (2006)