Surface finishes in a lead-free world. RoHS regulations force alternative formulations, processes

Metal Finishing

Volumn 105, Issue 1, 2007, Pages 25-28

  Milad, George ^a   Orduz, Mario ^a  

^a Central Research and Development Laboratory   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS ENGINEERING; PROCESS ENGINEERING; REGULATORY COMPLIANCE; SURFACE TREATMENT;

ALTERNATIVE FORMULATIONS; ORGANIC SOLDERABILITY PRESERVATIVES (OSP); PRINTED CIRCUIT INDUSTRY; SOLDERABILITY; SURFACE FINISHES;

FINISHING;

EID: 34347219124     PISSN: 00260576     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-0576(07)80007-9     Document Type: Article

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