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Materials Science and Engineering: A

Volumn 528, Issue 18, 2011, Pages 5955-5960

Interface between Sn-Sb-Cu solder and copper substrate

(5) Sebo P a Svec P b,c Janickovic D b Illekova E b Plevachuk, Yu d

a INSTITUTE OF MATERIALS AND MACHINE MECHANICS (Slovakia)

b INSTITUTE OF PHYSICS (Slovakia)

c SLOVAK UNIVERSITY OF TECHNOLOGY (Slovakia)

d IVAN FRANKO NATIONAL UNIVERSITY OF LVIV (Ukraine)

Author keywords

Cu joints; Differential scanning calorimetry; Lead free solder; Shear strength

Indexed keywords

BINARY ALLOYS; CALORIMETERS; COPPER; DROPS; LEAD-FREE SOLDERS; MELTING; MICROSTRUCTURE; SCANNING ELECTRON MICROSCOPY; SOLIDIFICATION; SUBSTRATES; TIN ALLOYS; X RAY DIFFRACTION;

COPPER SUBSTRATES; CU JOINT; DIFFUSION-REACTION; ENERGY DISPERSIVE SPECTROMETRY; INTERFACIAL TRANSITION ZONE; LIQUID SOLDERS; MELTING AND SOLIDIFICATION; SHEARS STRENGTH; SOLIDIFICATION TEMPERATURE; X- RAY DIFFRACTIONS;

DIFFERENTIAL SCANNING CALORIMETRY;

EID: 79956303691 PISSN: 09215093 EISSN: None Source Type: Journal
DOI: 10.1016/j.msea.2011.04.008 Document Type: Article

Times cited : (16)

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