SCOPUS 정보 검색 플랫폼

Solid State Sciences

Volumn 13, Issue 3, 2011, Pages 553-558

Preparation of metallic copper nanoparticles in aqueous solution and their bonding properties

(4) Kobayashi, Y a Shirochi, T a Yasuda, Y b Morita, T b

a IBARAKI UNIVERSITY (Japan)

b HITACHI LTD (Japan)

Author keywords

Aqueous solution; Bonding; Colloid; Copper; Nanoparticle

Indexed keywords

AQUEOUS SOLUTIONS; BONDING PROPERTY; BONDING TECHNIQUES; CETYL TRIMETHYL AMMONIUM BROMIDES; COLLOID SOLUTIONS; CU SUBSTRATE; METALLIC COPPER; METALLIC CU NANOPARTICLES; REDUCING REAGENTS; ROOM TEMPERATURE;

AMMONIUM COMPOUNDS; BROMINE COMPOUNDS; CITRIC ACID; COLLOID CHEMISTRY; COLLOIDS; COPPER; COPPER COMPOUNDS; HYDRAZINE; SHEAR STRENGTH; SOLUTIONS;

NANOPARTICLES;

EID: 79952037488 PISSN: 12932558 EISSN: None Source Type: Journal
DOI: 10.1016/j.solidstatesciences.2010.12.025 Document Type: Article

Times cited : (48)

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