Preparation of CNT-copper matrix composite films

Journal of Nanoscience and Nanotechnology

Volumn 9, Issue 10, 2009, Pages 6096-6103

  Menzel, S B ^a   Thomas, J ^a   Weissker U ^a   Schaffel F ^a   Hossbach C ^a   Albert, M ^b   Hampel, S ^a   Gemming, T ^a  

^a IFW DRESDEN   (Germany)

^b DRESDEN UNIVERSITY OF TECHNOLOGY   (Germany)

Author keywords

CNT copper reinforcement; Copper matrix composite films; Cu electroplating

Indexed keywords

CATALYTIC CVD; CNT COPPER REINFORCEMENT; COPPER MATRIX; COPPER MATRIX COMPOSITE; COPPER MATRIX COMPOSITE FILMS; CU ELECTROPLATING; CU FILMS; ELECTRICAL PROPERTY; ELECTROPLATED COPPER FILM; INTERFACIAL STRENGTH; IRON CATALYST; LOW DENSITY; MULTI-WALL CARBON NANOTUBES; MULTI-WALL CNT; PLASMA-ENHANCED ATOMIC LAYER DEPOSITION; SI SUBSTRATES; UNDERLAYERS;

CARBON FILMS; CARBON NANOTUBES; CATALYSTS; CHEMICAL VAPOR DEPOSITION; CONDUCTIVE FILMS; COPPER; COPPER PLATING; ELECTRIC PROPERTIES; ELECTROPLATING; FILM PREPARATION; METALLIC FILMS; METALLIC MATRIX COMPOSITES; MICROSTRUCTURE; MULTIWALLED CARBON NANOTUBES (MWCN); PLASMA DEPOSITION; PLASMAS; REINFORCED PLASTICS; REINFORCEMENT; TANTALUM;

COMPOSITE FILMS;

EID: 70350302192     PISSN: 15334880     EISSN: None     Source Type: Journal    
DOI: 10.1166/jnn.2009.1574     Document Type: Conference Paper

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