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Volumn 25, Issue 38, 2009, Pages 37-46
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Influence of carbon nanotubes on the electrodeposition of copper interconnects
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Author keywords
[No Author keywords available]
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Indexed keywords
CARBON NANOTUBES;
CHRONOAMPEROMETRY;
COMPOSITE FILMS;
COPPER;
ELECTRODEPOSITION;
ELECTRODES;
ANNEAL TEMPERATURES;
CO DEPOSITION;
COPPER INTERCONNECTS;
CU ELECTRODEPOSITIONS;
CU EXCHANGES;
ELECTROCHEMICAL DATA;
EQUILIBRIUM POTENTIALS;
KINETIC DATA;
INTEGRATED CIRCUIT INTERCONNECTS;
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EID: 79952759923
PISSN: 19385862
EISSN: 19386737
Source Type: Conference Proceeding
DOI: 10.1149/1.3390656 Document Type: Conference Paper |
Times cited : (6)
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References (15)
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