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Journal of the Electrochemical Society

Volumn 157, Issue 3, 2010, Pages

Cu-MWCNT composite films fabricated by electrodeposition

(3) Arai, Susumu a Saito, Takashi a Endo, Morinobu a

a SHINSHU UNIVERSITY (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

BATH TEMPERATURES; COMPACT MICROSTRUCTURE; COMPOSITE PLATING; DISPERSING AGENT; ELECTRICAL CONDUCTIVITY; ELECTRICAL RESISTIVITY; ELECTRODEPOSITION CONDITIONS; INTERNAL STRESS; MAXIMUM VALUES; PLATING BATH; SMOOTH SURFACE; LOWER TEMPERATURES;

CARBON NANOTUBES; COPPER; ELECTRIC CONDUCTIVITY; ELECTROPLATING; HARDNESS; MICROSTRUCTURE; MORPHOLOGY; MULTIWALLED CARBON NANOTUBES (MWCN); SURFACE MORPHOLOGY; THERMAL CONDUCTIVITY; THERMAL CONDUCTIVITY OF SOLIDS; THERMOANALYSIS; ELECTRODEPOSITION; PLATING; YARN;

COMPOSITE FILMS;

EID: 76349101457 PISSN: 00134651 EISSN: None Source Type: Journal
DOI: 10.1149/1.3280034 Document Type: Article

Times cited : (75)

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