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Volumn , Issue , 2009, Pages 1871-1878
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CNTs - A comparable study of CNT-filled adhesives with common materials
a
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Author keywords
[No Author keywords available]
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Indexed keywords
ADVANCED MATERIALS;
APPLICATION RANGE;
AVIATION INDUSTRY;
BULK MATERIALS;
BULK PROPERTIES;
CNT-POLYMER COMPOSITES;
COMMON MATERIALS;
COMPREHENSIVE STUDIES;
CONDUCTIVE ADHESIVE;
CONDUCTIVE ELEMENTS;
CONVENTIONAL MATERIALS;
DESIGN ENGINEERS;
DISSIPATION LOSS;
ELASTIC MATERIALS;
ELECTRICAL AND MECHANICAL PROPERTIES;
ELECTRICAL COMPONENTS;
ELECTRICAL CONTACT RESISTANCE;
ELECTRICAL LOADING;
ELECTRICAL PROPERTY;
ELECTRONICS MANUFACTURING;
ELECTRONICS PACKAGE;
ENVIRONMENTAL CONDITIONS;
EPOXY COMPOSITE;
EVALUATION CRITERIA;
EXTREME CURRENT DENSITIES;
FILLED ADHESIVES;
FILLER FRACTION;
FILLER MATERIALS;
FR4 SUBSTRATES;
FREQUENCY SWEEP;
FUTURE APPLICATIONS;
GOLD METALLIZATION;
INTERNAL STRESS;
LASER FLASH;
MECHANICAL METHODS;
MICROELECTRONICS INDUSTRY;
MINIATURIZED ELECTRONICS;
MODIFIED FILLER;
NANO-MATERIALS;
NEW MATERIAL;
PACKAGING TECHNOLOGIES;
PERFORMANCE ISSUES;
PHYSICAL BARRIERS;
PRINTED WIRING BOARDS;
RELATIVE HUMIDITIES;
RHEOLOGICAL PROPERTY;
SURFACE FINISHES;
SURFACE MODIFICATION;
TEMPERATURE CYCLE TEST;
TEST PROCEDURES;
THERMAL CYCLE;
THERMAL LOSS;
THERMAL PROPERTIES;
THERMAL-MECHANICAL BEHAVIOUR;
THERMOMECHANICAL PROPERTIES;
TIME DEPENDENT;
TORSION TESTS;
ULTRASONIC METHODS;
VISCO-ELASTIC MATERIAL;
VISCOELASTIC BEHAVIOUR;
ADHESIVE JOINTS;
ADHESIVES;
ATMOSPHERIC HUMIDITY;
AUTOMOBILE ELECTRONIC EQUIPMENT;
CARBON NANOTUBES;
CONDUCTIVE MATERIALS;
CONTACT RESISTANCE;
CURING;
DYNAMIC ANALYSIS;
DYNAMIC MECHANICAL ANALYSIS;
ELECTRIC NETWORK ANALYSIS;
ELECTRIC PROPERTIES;
ELECTRONICS PACKAGING;
FILLERS;
MICROELECTRONICS;
MOISTURE;
NANOSTRUCTURED MATERIALS;
PACKAGING MATERIALS;
PRINTED CIRCUIT BOARDS;
RESEARCH;
RHEOLOGY;
SHEAR STRENGTH;
SILVER;
TECHNOLOGY;
TESTING;
THERMAL CONDUCTIVITY;
THICK FILMS;
TIN;
TORSION TESTING;
VISCOSITY;
WIRELESS TELECOMMUNICATION SYSTEMS;
MECHANICAL PROPERTIES;
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EID: 70349686443
PISSN: 05695503
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1109/ECTC.2009.5074275 Document Type: Conference Paper |
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Times cited : (9)
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References (10)
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