Fabrication of CNTs/Cu composite thin films for interconnects application

Microelectronic Engineering

Volumn 85, Issue 10, 2008, Pages 1984-1987

  Liu, Ping ^a   Xu, Dong ^a   Li, Zijiong ^a   Zhao, Bo ^a   Kong, Eric Siu Wai ^a   Zhang, Yafei ^a  

^a BEIJING UNIVERSITY OF POSTS AND TELECOMMUNICATIONS   (China)

Author keywords

Annealing; Carbon nanotube; Composite film; Interconnects

Indexed keywords

ANNEALING; CARBON FILMS; COMPOSITE FILMS; COPPER ALLOYS; ELECTRIC PROPERTIES; ELECTROCHEMISTRY; ELECTROPHORESIS; ELECTROPLATING; METALLIC FILMS; METALLIZING; OPTICAL DESIGN; SOLIDS; THICK FILMS; THIN FILMS;

ANNEALING TEMPERATURE; CARBON NANOTUBE; COMPOSITE FILM; COMPOSITE THIN FILMS; CU FILM; CU FILMS; CU THIN FILMS; CU(111); DEPOSITION TECHNIQUES; ELECTRICAL PROPERTIES; ELECTRICAL RESISTANCES; GRAIN SIZES; INTERCONNECTS; RELATIVE INTENSITIES;

COPPER;

EID: 52349097774     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2008.04.046     Document Type: Article

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